Ultrashort-Pulse Laser Micro/Nanoprocessing Equipment
Equipped with an ultrafast laser, this system supports high-speed galvanometer scanning; arrays of micro- and nanoholes; high-aspect-ratio holes; superhydrophobic micro/nanostructures; biomimetic surface microstructures; and surface stripping and etching with customizable depth and selectable material types.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Working area [Customizable; LTCC Green Ceramic Tape and Ferrite Materials] | 250mm×250mm (customizable) LTCC green ceramic sheets and ferrite materials |
| Power | Through Holes, Blind Holes, Etching and Cutting |
| Wavelength [Selectable bands; dual-path and triple-path systems can be integrated.] | 1064/532/355nm (Selectable Bands; Dual-Path and Triple-Path Systems Can Be Integrated) |
| Pulse width [optional] | fs 、 ps optional |
| Focused Spot [Customizable] | 5-25μm(customizable) |
| Drilling Aspect Ratio [Drilling Module Selection] | 1: 20(Drilling Module Selection) |
| Loading and Unloading Method | Fully Automatic |
Applications
Key Features
Datasheet
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