Ultraviolet Picosecond Precision Micromachining Equipment DPS21
This specialized equipment cuts and grooves materials and adhesive products such as LCP/MPI/COF/COP/PI/CPI for automotive and consumer electronics.
Specification Snapshot
Positioning accuracy
±3μm
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Overview
This specialized equipment cuts and grooves materials and adhesive products such as LCP/MPI/COF/COP/PI/CPI for automotive and consumer electronics.
Specifications
| Parameter | Value |
|---|---|
| Equipment Workstations | Single Beam Path, Dual Stations |
| Scanning Range | 54mm×54mm (customizable) |
| Working area | 550mm×650mm/350mm×500mm(customizable) |
| Positioning accuracy | ±3μm |
| Repeatability | ±2μm |
| Depth Control | ≤±5μm |
Applications
Processing 5G materials such as LCP, MPI, and PTFE; circuit-board materials such as PCB, FPC, and rigid-flex boards; films such as PI, CPI, COP, and COF; adhesive applications including AB adhesive, 3M, TESA, black/white adhesive, self-adhesive materials, double-sided tape, easy-peel tabs, conductive fabric, PE foam adhesive, PET film, PVC film, antistatic film, and blue film; semiconductor applications such as silicon wafers.
Key Features
In-house-developed high-power UV picosecond laser offers good cost performance; controlled processing improves edge chipping and thermal effects; in-house dual-station processing system is stable and reliable and improves efficiency; mature processing system accurately calculates and segments patterns and coordinates processing parameters with patterns.
Datasheet
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Supplier Information
Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.
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