Precision Laser Soldering Machine LWF30

Precision Laser Soldering Machine LWF30

Supplier
Delphilaser
Part Number
LWF30
Category
Laser Processing Equipment
Origin
China

This pioneering product independently developed by Delong supports high-speed automatic solder feeding and simultaneous laser soldering. Its CCD positioning system automatically identifies targets for precise, high-speed soldering. It can operate independently or be integrated into an automated production line.

Specification Snapshot
Positioning accuracy
±10μm
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Overview

This pioneering product independently developed by Delong supports high-speed automatic solder feeding and simultaneous laser soldering. Its CCD positioning system automatically identifies targets for precise, high-speed soldering. It can operate independently or be integrated into an automated production line.

Specifications

ParameterValue
Equipment WorkstationsSingle Platform
Optical output modeScanning / Point Laser / Line Laser / Area Laser (Customizable)
Working area200×200mm—1200×1500mm(customizable)
Positioning accuracy±10μm
Repeatability±5μm

Applications

PCB/FPC boards, PCB pin components, PCB wiring, PCB pins, and gold fingers/FPC; semiconductor packaging and testing, wafers, MEMS, BGA, HDD, CCM modules, CCM camera welding, and VCM camera motors.

Key Features

Multistage adjustable energy simulates reflow temperature profiles; selectable custom waveforms precisely control solder-joint conditions. Temperature-profile correction compares feedback with a reference and adjusts it for more reliable mass-production stability. Temperature-control frequency up to 10KHz provides real-time feedback and tracking of solder-joint temperature changes.

Datasheet

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Supplier Information

De
Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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Precision Laser Soldering Machine LWF30
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