Glass Laser Drilling Equipment LGE10

Glass Laser Drilling Equipment LGE10

Supplier
Delphilaser
Part Number
LGE10
Category
Laser Processing Equipment
Origin
China

This equipment uses high-energy lasers for efficient glass drilling, with automatic vision positioning and an operating safety system to support automatic high-speed drilling.

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Overview

This equipment uses high-energy lasers for efficient glass drilling, with automatic vision positioning and an operating safety system to support automatic high-speed drilling.

Specifications

ParameterValue
Working area [Customizable]550mm×650mm(customizable)
Processing speed [Diameter 10mm, Thickness 3mm Green Light]9.8 seconds/hole (diameter 10mm, thickness 3mm, green light)
Processing speed [Diameter 10mm, Thickness 3mm Red Light]4.2 seconds/hole (diameter 10mm, thickness 3mm, red light)
Processing Edge Chipping [Green light]<0.1mm
Processing Edge Chipping [Red light]<0.3mm
Glass Thickness0.1mm~19mm
Machining radius≥0.1mm
Glass Material [Excluding Tempered Glass]Various Types of Glass (Excluding Tempered Glass)

Applications

Button/earpiece-hole drilling in strengthened phone glass, including Corning, Schott, and Asahi Glass; drilling OLED/LCD/LTPS display glass, protective films on strengthened phone glass, quartz, and masks.

Key Features

Noncontact processing with minimal drilling-edge chipping and high quality; precision drilling with minimum hole radius 0.1mm; industrial design for 7×24 operation and long-term stability; safe, convenient operation.

Datasheet

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Supplier Information

De
Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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Glass Laser Drilling Equipment LGE10
Delphilaser · Laser Processing Equipment
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