Integrated Laser Die-Cutting and Slitting Machine

Integrated Laser Die-Cutting and Slitting Machine

Supplier
Delphilaser
Category
Laser Processing Equipment
Origin
China

High-quality cut edges with burrs below 20um and heat-affected zones below 80μm; precision paired-roller transport; total-length accuracy: +1.5mm for 6m electrode sheets and 3mm for 12m sheets; high-speed laser-cutting control; stable production speed at least 60m/min when tab height is below 25mm.

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Overview

High-quality cut edges with burrs below 20um and heat-affected zones below 80μm; precision paired-roller transport; total-length accuracy: +1.5mm for 6m electrode sheets and 3mm for 12m sheets; high-speed laser-cutting control; stable production speed at least 60m/min when tab height is below 25mm.

Key Features

High-quality cut edges with burrs <20μm and heat effects <80μm; precision roller feed, total-length accuracy +1.5mm (6m electrode), 3mm (12m electrode); high-speed laser control maintains production ≥60m/min (tab height <25mm); magnetic iron removal, air-knife/brush cleaning, vacuum extraction, FFU, and extraction fans control dust/foreign matter without residue; vacuum scrap collection/compression supports extended efficient operation.

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Supplier Information

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Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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Integrated Laser Die-Cutting and Slitting Machine
Delphilaser · Laser Processing Equipment
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