Automotive Film/Glass Laser Etching Equipment LEC15
This equipment is designed for laser etching of conductive films on automotive windshields. Its two stations can be loaded from the front and rear, allowing one side to be loaded while the other is etched. Automatic loading and unloading can be implemented as required.
Specification Snapshot
Positioning accuracy
±4μm
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Overview
This equipment is designed for laser etching of conductive films on automotive windshields. Its two stations can be loaded from the front and rear, allowing one side to be loaded while the other is etched. Automatic loading and unloading can be implemented as required.
Specifications
| Parameter | Value |
|---|---|
| Single-Pass Film Removal Range | 300mm×300mm |
| Platform Dimensions | 1850mm×1350mm |
| Positioning accuracy | ±4μm |
| Repeatability | ±3μm |
| Scanning Accuracy | ≤±10μm |
Applications
Film-removal processes for automotive windshield HUDs, car roofs, and rear-view mirrors
Key Features
Large-format equipment with customizable dimensions; high processing accuracy and good results without micro-shorts; automation-compatible for fully automatic loading/unloading; self-developed software for safe, convenient operation.
Datasheet
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Supplier Information
Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.
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