Wafer Laser Circumferential-Cutting Equipment
Laser edge trimming is performed before debonding bonded wafers. The cut extends to the glass carrier, ensuring complete penetration through the RDL and release-adhesive layers while controlling glass-carrier damage to a depth of 0~20 micrometers.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Equipment Capabilities | EMC Slotting, Edge trim |
| Laser Type | UV（Ps） |
| Processing material | EMC、Si、Pi etc. |
| Wafer Size | 12" |
| Processing capability | Cuts fully through EMC and PI+RDL, with controllable damage to the glass carrier. |
| Wafer Thickness | ≥200μm |
| Processing accuracy | tolerance≤±30μm |
| Wafer Warpage [200-1000μm] | 200-1000μm，≤5mm |
| Wafer Warpage [1000-2000μm] | 1000-2000μm，≤3mm |
| Additional Equipment Capabilities | Two-Fluid Cleaning |
| Loading Module | Bare wafer Load Port*2 |
| Communication Method | SECS/GEM |
Applications
Datasheet
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