Wafer Laser Stress-Induced Cutting Equipment
Stress-induced cutting of Mini LED wafers.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Laser Type | Diode-Pumped Picosecond Laser |
| Laser Power | ≥1W |
| Cooling method | Closed-loop circulating water cooling |
| X Axis - Travel | 360mm |
| X-Axis Resolution | 0.1um |
| Y Axis - Travel | 300mm |
| Y-Axis Resolution | 0.1um |
| Z Axis - Travel | 15mm |
| Z-Axis Resolution | 1um |
| θ Axis - Travel | ±60° |
| θ-Axis Resolution | 0.0001° |
| Dicing speed | ≤1000mm/s |
| 4-Inch Processing Capacity [@10*30mil（4 inches ）] | 15pcs/h@10*30mil（4 inches ） |
| Dicing dimensions [Can Be Upgraded 6 inch] | 2 inch 、4 inch （ Can Be Upgraded 6 inch ） |
| Dual-Focus Function | Optional |
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Datasheet
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