Wafer low-k Layer Laser Slotting Equipment
Uses a laser to groove wafer dicing streets. Blade dicing of wafers with Low-k films can cause delamination; laser grooving suppresses delamination for high-quality processing.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Processing method | Laser Grooving |
| Laser | Beilin/SP |
| Applicable Products | Low-K/CMOS and Other Semiconductor Wafers |
| Laser Type [Wavelength 355nm] | Ultraviolet picosecond （ Wavelength 355nm） |
| Slot Depth | ≥10μm |
| Laser Energy | ≥30W |
| Slotting Speed | 0~1000mm/s |
| Processing frequency [Narrow] | 2000KHz |
| Processing frequency [Wide] | 500KHz |
| Slotting Method | Dual narrow + Dual wide |
| Cooling method [Cooling Medium: Distilled Water] | Water-Cooled (Cooling Medium: Distilled Water) |
| Slot Inspection | Width Detection |
| Laser Service life | ≥20000h |
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Datasheet
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