High-Speed Thick-Glass Cutting Equipment LGC33
This equipment stably cuts thick glass using a special optical system and an independently developed customized high-power picosecond laser. Automatic imaging alignment ensures accuracy. Robots and loading/unloading modules can be added for automated processing and higher throughput.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Working area [Customizable] | 1000×800(customizable) |
| Processing speed | ＜500mm/s |
| Processing Edge Chipping | ＜20um |
| Cutting thickness | 6-19mm |
| Machining radius | ＞0.5mm |
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