Roll-to-Sheet Laser Processing Equipment DRP01
This automated roll-to-sheet and roll-to-roll equipment processes coverlays, COF, CPI and adhesive products. Single- and dual-optical-path systems provide high processing accuracy and speed.
Specification Snapshot
Equipment Type
Dual-Head Roll-to-Sheet Processing
Positioning accuracy
±3μm
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Overview
This automated roll-to-sheet and roll-to-roll equipment processes coverlays, COF, CPI and adhesive products. Single- and dual-optical-path systems provide high processing accuracy and speed.
Specifications
| Parameter | Value |
|---|---|
| Equipment Type | Dual-Head Roll-to-Sheet Processing |
| Scanning Range | 54mm×54mm (customizable) |
| Working area | 300mm×500mm |
| Positioning accuracy | ±3μm |
| Repeatability | ±2μm |
| Depth Control | ≤±5μm |
Applications
FPC coverlay roll-to-sheet, FPC coverlay roll-to-roll and FPC auxiliary-material processing; roll-to-sheet and roll-to-roll processing of films such as adhesive films and SONY adhesive
Key Features
Optional dual- and four-optical-path systems improve processing efficiency; high accuracy and good product results without microshorts; fully automated processing saves labor costs and improves productivity; safe and convenient operation
Datasheet
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Supplier Information
Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.
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