Roll-to-Roll FPC Drilling Application Equipment PLD10
This equipment performs precision PCB drilling, including blind and through-holes in double-sided copper-clad boards. Its efficiently integrated laser, optical path, galvanometer system, three-axis motion platform and imaging system enable fast, accurate processing.
Specification Snapshot
Positioning accuracy
±3μm
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Overview
This equipment performs precision PCB drilling, including blind and through-holes in double-sided copper-clad boards. Its efficiently integrated laser, optical path, galvanometer system, three-axis motion platform and imaging system enable fast, accurate processing.
Specifications
| Parameter | Value |
|---|---|
| Scanning Range [Customizable] | 40mm×40mm(customizable) |
| Working area [Customizable] | 550mm×650mm(customizable) |
| Positioning accuracy | ±3μm |
| Repeatability | ±2μm |
| Processing Pattern | Blind Holes, Through Holes |
Applications
Precision drilling of FPC, including blind holes and through holes in double-sided copper-clad laminates.
Key Features
Linked galvanometer/stage motion improves speed, precision, and throughput; automatic recognition/target acquisition; thermal control improves chipping/heat impact; mature software calculates/divides graphics and matches processing parameters to patterns.
Datasheet
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Supplier Information
Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.
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