Fully Automatic High-Speed Glass Laser Cutting Equipment LGC20

Fully Automatic High-Speed Glass Laser Cutting Equipment LGC20

Supplier
Delphilaser
Part Number
LGC20
Category
Laser Processing Equipment
Origin
China

This equipment efficiently cuts glass using specially shaped high-energy infrared picosecond laser pulses. It has entered volume use in smart wearables, home appliances, security products and mobile-phone cover-glass cutting.

Specification Snapshot
Equipment Type
Small-Format Glass
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Overview

This equipment efficiently cuts glass using specially shaped high-energy infrared picosecond laser pulses. It has entered volume use in smart wearables, home appliances, security products and mobile-phone cover-glass cutting.

Specifications

ParameterValue
Equipment TypeSmall-Format Glass
Working area200mm×200mm~1600mm×2600mm(customizable)
Processing speedStraight Line 1000mm/s, Curve 500mm/s
Processing Edge Chipping<20μm
Cutting thickness1-19mm
Machining radius≥0.5mm
Processing materialOrdinary Glass

Applications

Panel-Glass Cutting for Household Appliances, Automotive, Touch and Smart-Wearable Products

Key Features

Extremely narrow kerf <20μm; no cutting debris; noncontact processing with little material damage and high accuracy; layered, thorough cutting suitable for unstrengthened glass with high post-cut separation yield; virtually no glass debris during cutting and high cutting efficiency; optional automatic loading/unloading.

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Supplier Information

De
Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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Fully Automatic High-Speed Glass Laser Cutting Equipment LGC20
Delphilaser · Laser Processing Equipment
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