Fully Automatic Inline Carrier-Board Marking Equipment FPM20

Fully Automatic Inline Carrier-Board Marking Equipment FPM20

Supplier
Delphilaser
Part Number
FPM20
Category
Laser Processing Equipment
Origin
China

This equipment automatically laser-marks substrate units with defects from earlier PCB processes. It automatically identifies defect marks, information and product IDs from previous inspection, determines the corresponding defective unit and performs marking and drilling.

Specification Snapshot
Positioning accuracy
±5μm
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Overview

This equipment automatically laser-marks substrate units with defects from earlier PCB processes. It automatically identifies defect marks, information and product IDs from previous inspection, determines the corresponding defective unit and performs marking and drilling.

Specifications

ParameterValue
Maximum Workpiece Load [Customizable]300mm×150mm(customizable)
Repeatability±5μm
Positioning accuracy±5μm
Processing PatternArbitrary Patterns

Applications

Automated inline marking on production lines for PCB, display modules, electronic devices, and consumer electronics.

Key Features

Adjustable feed channel for product size; multiple transfer sensors; fast, stable linear-motor transport; tailored laser/marking choices; efficient line-scan defect inspection; active mistake/omission prevention; realtime central-computer communication; double-sided marking with automatic flipping.

Datasheet

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Supplier Information

De
Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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Fully Automatic Inline Carrier-Board Marking Equipment FPM20
Delphilaser · Laser Processing Equipment
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