Small- and Medium-Format Thin-Film Laser Etching Equipment LES45

Small- and Medium-Format Thin-Film Laser Etching Equipment LES45

Supplier
Delphilaser
Part Number
LES45
Category
Laser Processing Equipment
Origin
China

This equipment mainly etches silver-paste and copper-paste conductive coatings, ITO coatings and nanosilver coatings on PET film or glass substrates. It offers customizable large processing formats including 600×600 and 650×1050, with a multihead high-speed optical system.

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Overview

This equipment mainly etches silver-paste and copper-paste conductive coatings, ITO coatings and nanosilver coatings on PET film or glass substrates. It offers customizable large processing formats including 600×600 and 650×1050, with a multihead high-speed optical system.

Specifications

ParameterValue
Equipment WorkstationsDual Heads, Single Station
Working area [1050mm×650mm]≤43inch
Scanning Working Area120mm×120mm/170mm×170mm( Selectable )
Processing linewidth15μm-40μm( adjustable )
Overall Accuracy±25μm
Stitching Accuracy≤±5μm
Etching SpeedEtching Speed: 2000mm/s-10000mm/s

Applications

Etching silver-paste and copper-paste conductive coatings, ITO coatings, and nanosilver coatings on PET films or glass substrates; GF, GFF, and OGS touchscreens in phones and smart wearables; etching conductive films on OGS automotive touchscreens; processing medical devices such as blood-glucose test strips.

Key Features

Supports 15μm narrow-border processing; mature processes support narrow-linewidth machining on small and medium formats; in-house operating system is simple and easy to use; efficient, stable, low-cost processing with high cost performance; simple structure facilitates maintenance with low maintenance cost; comprehensive after-sales service resolves customer issues promptly and effectively.

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Supplier Information

De
Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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Small- and Medium-Format Thin-Film Laser Etching Equipment LES45
Delphilaser · Laser Processing Equipment
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