TOPCon Laser-Enhanced Sintering Equipment

TOPCon Laser-Enhanced Sintering Equipment

Supplier
Delphilaser
Category
Laser Processing Equipment
Origin
China

Laser-enhanced contact optimization (LECO) equipment improves contact resistance in crystalline-silicon solar cells. By reducing metal-semiconductor recombination losses and improving contact between electrode grid lines and the cell, it increases photovoltaic conversion efficiency.

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Overview

Laser-enhanced contact optimization (LECO) equipment improves contact resistance in crystalline-silicon solar cells. By reducing metal-semiconductor recombination losses and improving contact between electrode grid lines and the cell, it increases photovoltaic conversion efficiency.

Specifications

ParameterValue
Operating ModeInline
Compatible Silicon Wafer Dimensions182-230mm
Compatible Silicon Wafer Thickness110-200μm
Equipment DimensionsL×W×H=2970×1450×2150
Equipment Dimensions-Total Length [Belt Retracted]3690 (Belt Retracted)
Pattern accuracy [@182mm]≤+15μm@182mm
Buffering MethodStacked Magazine
Number of Material Boxes(1+1)x2
Equipment Capacity [@182×182mm (Process-Dependent)]9000pcs/H@182×182mm (process-dependent)
Fragment Rate [@182 (>130μm, Excluding Incoming Material)]≤0.04%@182 (>130μm, excluding incoming material)

Applications

Laser-enhanced sintering (LECO) improves crystalline-silicon solar-cell electrode-grid contact resistance by reducing metal/semiconductor recombination loss, improving photoelectric conversion efficiency.

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Supplier Information

De
Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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TOPCon Laser-Enhanced Sintering Equipment
Delphilaser · Laser Processing Equipment
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