Infrared Picosecond Laser PHIR Series
The infrared ultrafast laser offers average power up to 300W, pulse energy 3.5mJ and excellent beam quality (M²<1.3). RS232, GATE and TRIG interfaces plus PSO functionality provide flexible control. It combines processing efficiency and stability for complex tasks such as >19mm-thick glass cutting. Modular construction simplifies integration/maintenance for continuous mass production. Precision cutting, drilling and through-hole processing of glass, sapphire and specialty materials have small heat-affected zones and stable quality for consumer electronics and advanced manufacturing.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Center wavelength | 1064nm |
| Average Power | >100W |
| Repetition rate | 30-2000KHz |
| Single-pulse energy | ≥3.5mj |
| Pulse width | 10ps |
| Beam quality M² | M²<1.3 |
| Spot roundness | ≥90% |
| Pointing Stability | ＜16urad |
| Power stability [RMS] | RMS ≤ 0.8% |
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Key Features
Datasheet
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