Wafer laser surface cutting and dicing machine (QL-6500)
Uses a high-quality beam to perform surface scribing and groove machining within the wafer dicing street; the chip quality and cutting efficiency after cutting far exceed blade dicing equipment. Equipped with automatic alignment and automatic adjustment devices, improving the degree of automation and making operation more convenient.;● Adopts picosecond laser processing technology, capable of fast cutting of sapphire, glass and other materials;;● High dimensional accuracy, small chipping, no taper;;● The optical path system uses imported lenses, ensuring high-quality optical transmission and good long-term stability;;● The equipment uses a marble base, combined with high-precision linear motors and a vision positioning system, enabling high-efficiency, high-precision stable processing over a relatively large area;;● Professionally designed automatic loading/unloading system, saving labor and improving efficiency;;● LCD full-screen cutting;● Glass/sapphire camera cover cutting;● Medical glass cutting;● Wearable product cover cutting and grooving;● Camera filter cutting;● Glass cutting for home appliances, automotive, etc.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Processing size range | 4 inch, 6 inch, 8 inch, 12 inch |
| Cutting line width | 10~30 μm |
| Cutting depth | 10~25 μm |
| Laser Power | 5 W |
| Laser wavelength | 355 nm/532 nm |
| Positioning Accuracy | ±2 μm |
| Rotary axis accuracy | ±3 ″ |
| Repeatability | ±1 μm |
| Effective table travel | 350 mm × 350 mm |
Datasheet
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