SIP chip laser grooving (BM-SIP-U15)
Qinghong Laser's original LRP technology plays an important role in the laser grooving process of SIP packaging. This technology enables rapid laser forming of various groove morphologies.; ● Laser grooving: enables rapid laser forming of various groove morphologies such as T-shaped grooves, I through grooves, V-shaped grooves, Y-shaped grooves, etc., with various sizes of groove width and groove depth. After laser grooving, the cross-section inside the groove is smooth and neat, with no residue inside, and the bottom Cu layer is undamaged and not broken down;; ● Shape (special-shaped) cutting: laser special-shaped cutting of various special-shaped contours, with accurate positioning and high cutting precision;; ● Laser marking: enables laser marking of chip content, serial numbers, etc.; ● (SIP) chip laser grooving; ● (SIP) chip shape (special-shaped) cutting; ● (SIP) chip laser marking
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Overview
Specifications
| Parameter | Value |
|---|---|
| Laser power | 30/40 W |
| Laser wavelength | 355 nm/532 nm |
| BOX range | 50 mm × 50 mm |
| Cutting dimensional accuracy | ±0.02 mm |
| Heat-affected size | ≤50 μm |
| Cutting taper | <1 ° |
| Stage travel | 300 mm × 300 mm |
| Stage repeat positioning accuracy | ±0.002 mm |
| Z-axis lifting travel | 25 mm |
| Positioning method | CCD vision positioning |
Datasheet
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