Fully automatic multi-chip sub-micron die bonder
The MV-15H-S eutectic machine has placement accuracy up to ±1.5μm and can be applied in industries such as high-power lasers, optical communications, and RF/microwave. Eutectic efficiency can reach up to UPH180. It possesses process capabilities including COC single-tube eutectic, Bar strip eutectic, and COC package eutectic, and supports complex processes such as friction eutectic. Supports fully automatic production line merging
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