AMB/DBC Substrate CO2 Laser Scribing Machine CPP12
This equipment is mainly used for laser scribing in the DBC industry and is widely used in packaging fields such as power electronic modules, semiconductor cooling and LED devices.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Equipment Type | Single Head, Single Platform, Standalone/Automated |
| Working area | 200mm×200mm(customizable) |
| Positioning accuracy | ±3μm |
| Repeatability | ±2μm |
| Scribing speed | 200mm/s |
| Cutting speed | 20mm/s |
| Cutting thickness | 2mm |
| Scribing depth | 500μm |
| Scribing width | 150μm |
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Datasheet
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Supplier Information
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