Fully automatic multifunctional sub-micron die bonder
The MV-15D placement accuracy can reach up to ±1.5μm; a single machine simultaneously possesses process capabilities such as eutectic, dip adhesive, dispensing, and UV; supports blue film, Gel Pack/waffle Pack, track, and other counterweight loading/unloading methods, and supports wafer map; supports multi-chip placement applications, with an optional 8-nozzle fully automatic quick-change module; the fully automatic loading/unloading system supports joining and networking with automated production lines
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