Full automatic double-axis projector
This equipment consists mainly of cutting equipment developed for the semiconductor, 3C industry. Cuts applied to materials such as silicon, ceramics, glass, and SiC. It has the advantage of cutting fast and positioning accuracy. Equipment equipped with high precision CCD visual systems; capable of auto-positioning and angle adjustment of works; and more efficient processing
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Overview
Specifications
| Parameter | Value |
|---|---|
| Circle workstation | Ø12″ |
| Active Process | 812.5mm; 440mm |
| Cut Process | 310mm |
| Process Resolution | 0.0001mm |
| Position precision | 0.003mm |
| Round range | ±180° |
| Repeat location precision | ±2 arcsec |
| Automatically locate works | Mark |
| Automatically locate the work | Mark |
| Altitude | Mark |
| Volume | 1700mm1405mm2202mm |
| Net heavy | 3040Kg |
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Key Features
Datasheet
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