Silicon tablet laser cutting intelligence equipment
Laser cutting for flat-wire silicon steel. They consist mainly of marble racks, XY-line electrical platforms, visual capture systems, super-fast laser systems and cooling systems
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Overview
Specifications
| Parameter | Value |
|---|---|
| Flat | <0.15mm |
| Parallel degrees | <0.3mm |
| Process Size Range | 100 mm-800 mm diameter |
| Vertical | <0.2mm |
| Cut width | <0.2mm |
| Cut speed | 10m/min |
| Cut thickness | 0.1mm-0.2mm |
| Cut Precision | ±0.2mm |
| Specification of electricity supply | 220V/50Hz |
| Environmental requirements | Temperature: 10-30° humidity: < 70% |
| Size of equipment | 2,000 mm long, 2000 mm wide, 1800 mm high |
| Equipment weight | 2200KG |
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