application PIC MFD fiber
VLINK MFD matches fiber-optic arrays with high accuracy V slots;
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Overview
VLINK MFD matches fiber-optic arrays with high accuracy V slots; manufactured through VLINK specially designed assembly and grinding processes; low penetration loss; high accuracy of core spacing; good quality of polished surface. Fiber-optic MFD matches the channel of the silicon optical chip. This product is an ideal option for connecting high-speed silicon-ray delivery and distribution modules
Applications
400/800G high speed transceiver by silicon photonics; COBO
Key Features
High precision of Core pitch of Fiber Array; High coupling efficiency; Comply with GR-1435 requirements; SSC function by fusing different core spot size fibers for small MFD PIC application; Different cladding/core/brand fibers are optional; Low loss and reflow high power handling
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Supplier Information
Wholly-owned subsidiary of Lightcomm Technology (Stock Code: 300620);
Shipments of fiber optic connectors for 400G/800G/1.6T and coherent optical modules have exceeded 10 million units;
Has obtained multiple patents for fiber arrays used in coherent communication and high coupling efficiency packaging of silicon photonic modules;
Possesses advanced automated production lines such as Zblock, receptacle, collimator, covering automatic assembly, press-fitting, and testing functions, providing customers with low-cost and high-quality products and services;
Customized products such as fiber protruding FAU, lens array FAU, high-temperature resistant FAU, self-aligning non-tuning FAU series, and FAU series suitable for PIC/CPO;
Has comprehensive R&D and testing equipment and reliability verification capabilities in the industry, including high-precision fiber array core pitch tester, OGP V-groove array tester, OCCR fiber damage detector, optical thin film coating machine, laser interferometer, scanning electron microscope, infrared thermal imager, laser cutting knife, rapid TC chamber.
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