Fiber Array Series
A typical core distance error of <0.5um for high-precision fiber core arrays.
Specification Snapshot
Return Loss
≥50dB
Dimensions
20.80.8; 31.51; 421; 531; 651; 871.5cm
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Overview
A typical core distance error of <0.5um for high-precision fiber core arrays. Treatment and process techniques combined with the Vlink patent; spacing from 85um ~ 3000um; number of corridors from 1CH ~ 256CH, etc. Almost any type of fiber-optic array can be customised for processing. Rapid R & D and bulk production can respond quickly and meet client needs
Specifications
| Parameter | Value |
|---|---|
| ch | Corning/YOFCG657A1/G657A2/G657B3/0M3/0M4 |
| Return Loss | ≥50dB |
Applications
400G/800G Module; WSS Density; Center Application; CPO Application; Module; Module
Key Features
Series Application Module; 45°FA FA RX PD Array Coupling; 5G; S5G Module; 25/50/100Gbps Module; DC Module; 5G WDM/WSS; WDM, WDM OTN/M-OTN, WDM PON ROADM/OXC; WDM WSS. 45° FA Application 100G Module; FA RX PD Array Coupling; Vlink; Module, FA Product; Density (24; core pitch error<1um) FA Application WSS Module; Vlink core pitch error 0.1um; Product
Datasheet
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Supplier Information
Wholly-owned subsidiary of Lightcomm Technology (Stock Code: 300620);
Shipments of fiber optic connectors for 400G/800G/1.6T and coherent optical modules have exceeded 10 million units;
Has obtained multiple patents for fiber arrays used in coherent communication and high coupling efficiency packaging of silicon photonic modules;
Possesses advanced automated production lines such as Zblock, receptacle, collimator, covering automatic assembly, press-fitting, and testing functions, providing customers with low-cost and high-quality products and services;
Customized products such as fiber protruding FAU, lens array FAU, high-temperature resistant FAU, self-aligning non-tuning FAU series, and FAU series suitable for PIC/CPO;
Has comprehensive R&D and testing equipment and reliability verification capabilities in the industry, including high-precision fiber array core pitch tester, OGP V-groove array tester, OCCR fiber damage detector, optical thin film coating machine, laser interferometer, scanning electron microscope, infrared thermal imager, laser cutting knife, rapid TC chamber.
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