Sapphire Lapping Slurry
(1) The product, used together with a resin copper plate, achieves a high removal rate for sapphire wafers while ensuring wafer surface quality; (2) Good cleaning performance and more environmentally friendly; (3) Strict quality control ensures product quality consistency and stability; (4) The diamond grit size can be adjusted according to customer requirements.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Sapphire Particle Size Specification | D50=4-6μm |
| Sapphire Abrasive Type | Polycrystalline-like diamond / polycrystalline diamond |
| Sapphire Property | Shake well; alcohol-based, oil-based carriers |
| Sapphire Particle Size Specification | D50=30-40μm |
| Sapphire Abrasive Type | Polycrystalline-like diamond |
| Sapphire Property | Shake well; alcohol-based carrier |
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