Dry Vacuum Pump

Output Mode: 恒流源 & 恒流+恒压源 Single-channel Constant Current Source Output Current Range: 50~2000mA Adaptive Voltage Range: 0~5V

The LASER X COC Aging Machine is a high-density burn-in and reliability test system designed for Chip-on-Carrier (COC) laser devices. The cabinet-type system integrates 10 aging units, each capable of loading 4 independently controlled aging drawers, and is compatible with 48/32-position fishbone fixtures that support offline loading. It provides constant current source and constant current + constant voltage source output modes with high precision and long-term stability, combined with TEC temperature control covering 60~100°C, ensuring accurate, stable and efficient long-term aging tests for laser diodes used in optical communication and optoelectronic manufacturing.

Total Number of Channels: 384 Total Number of Layers: 8 Power Supply Channels per Layer: 2

The LASER X BT-4343 is a high-capacity industrial laser COS (Chip on Submount) aging machine designed for burn-in and reliability testing of high-power semiconductor laser chips. The system integrates 384 test channels across 8 layers, with 2 power supply channels per layer and 24 COS per channel connected in series. It supports both CW and QCW aging modes with a minimum QCW pulse width of 3ms, a current output range of 1~80A, and an adaptive voltage range of 20~50V. Each COS is independently monitored online for optical power, temperature and voltage, enabling real-time tracking of the aging status. A reserved wavelength reading interface allows chip junction temperature calibration via an external spectrometer. The system adopts water-cooling temperature control, and is equipped with comprehensive alarm and protection mechanisms, including cooling water flow over-limit alarm and leakage detection, ensuring the safety of personnel, chips and equipment.

Suitable Incoming Material Types: Gel-Pack / Waffle Pack / 蓝膜 Suitable Devices: COC, Lens, PLC等 Conversion Capability 1: 6寸蓝膜—鱼骨夹具之间 相互转换

The LASER X Automatic Transfer Machine is a high-precision automated handling system designed for the mutual conversion and transfer of optoelectronic devices among different carrier formats. It supports incoming materials in Gel-Pack, Waffle Pack, and blue film formats, and is suitable for devices such as COC, Lens, and PLC. The machine enables bidirectional conversion between 6-inch blue film and fishbone fixtures, 2-inch GelPak and fishbone fixtures, 6-inch blue film and 2-inch GelPak, as well as blue film-to-blue film and GelPak-to-GelPak transfers. Equipped with OCR character reading, system data connection, and COC sorting functions, it achieves a repeat positioning accuracy of ±10μm for devices sized 1.5*1.5mm~2.5*2.5mm, making it an ideal solution for automated optoelectronic device packaging and manufacturing.

Output Mode: CW & Pulse Output Current Range: 0~3A / 0~1A Adaptive Voltage Range: 0~7V / 0~18V

The High Power COS Testing Machine is a fully enclosed, integrated test platform designed for comprehensive characterization of high-power laser diode COS (Chip on Submount) devices, including pump lasers and industrial lasers. It combines a precision CW & Pulse current source (0~3A / 0~1A) with optical power measurement, spectrum analysis (600~1700nm), far-field scanning, polarization extinction ratio (PER) testing, and TEC-based temperature control (20~100℃) in a single sealed chamber with a settable test environment temperature of 0~100℃. The machine supports LIV, PER, spectrum and far-field tests in one station, and its test fixtures are fully compatible with burn-in machines, enabling seamless process flow from device testing to aging.

Chamber Material: Stainless Steel Chamber Structure: Vertical cylindrical chamber with curved front door Viewing window: Rectangular vertical viewing window on the door

This product is a vertical cylindrical stainless steel vacuum chamber designed for optical, optoelectronic and vacuum-environment testing applications. The chamber features a curved front door with a vertical rectangular viewing window, allowing real-time observation of internal devices under test. The door is secured by multiple high-strength fastening bolts distributed around the flange to ensure reliable vacuum sealing, and is equipped with heavy-duty hinges and an industrial handle for easy opening and closing. Multiple feedthrough and interface ports are arranged at the bottom and on the side walls, supporting electrical feedthroughs, vacuum pumping, gas inlet and sensor connections. The chamber can be integrated with optical windows, lasers, detectors and measurement instruments for vacuum-based photoelectric experiments and product validation.