Fully automatic splitting machine (QL-6100)
Unattended fully automatic operation;; Automatic recipe file retrieval by scanning code;; Intelligent contour processing for broken wafers;; Automatic calibration function for continuous processing;; Foreign object detection function for material sheets;; Gripper anti-collision function;; Blade wear monitoring and warning function;; LED, semiconductor wafer splitting (SiC, Si, GaN, sapphire and other brittle materials);; Substrate splitting in other industries (ceramics, glass and other brittle materials)
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Overview
Unattended fully automatic operation;; Automatic recipe file retrieval by scanning code;; Intelligent contour processing for broken wafers;; Automatic calibration function for continuous processing;; Foreign object detection function for material sheets;; Gripper anti-collision function;; Blade wear monitoring and warning function;; LED, semiconductor wafer splitting (SiC, Si, GaN, sapphire and other brittle materials);; Substrate splitting in other industries (ceramics, glass and other brittle materials)
Specifications
| Parameter | Value |
|---|---|
| Processing size range | 2 inch / 4 inch / 6 inch (8 inch and above products require customization) |
| Applicable chip size | 3*5 mil~150*150 mil (other sizes can be verified together) |
| Appearance yield | ≥99 % |
| Worktable height difference | ≤0.005 mm |
| Blade inspection straightness | ±0.004 mm |
| X-axis working stroke | 0-600 mm |
| Y-axis working stroke | 160 mm |
| X/Y repeat positioning accuracy | ±0.002 mm |
| Blade/worktable length | 120/165 mm optional, other lengths require customization |
Datasheet
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Supplier Information
Shenzhen Qinghong Laser Technology Co., Ltd. is located at No. 4 Industrial Avenue, Tangwei Community, Fuhai Street, Bao'an District, Shenzhen, with a factory area of 13,500 square meters. The company has a complete R&D, production, sales, and service team, and its business scope covers products and services for laser and full-line automation equipment.
Qinghong Laser focuses on the development of ultrafast laser (picosecond, femtosecond) precision micromachining and laser processing full-line automation systems. Its professional dust-free optical laboratory can provide R&D and proofing work for the industry's most advanced processing technologies. Products are mainly used in automated full-line systems for laser precision cutting, drilling, and etching of brittle materials (glass, sapphire, ceramics, etc.), photovoltaic cells (perovskite cells, thin-film cells), and semiconductors (LED wafers, IC chips). Products mainly serve related industries such as photovoltaic cells, semiconductors, and consumer electronics. Qinghong Laser has carried out exchanges and cooperation at different levels with many laser companies and research institutions in China, Europe, and the United States.
The company has a clean and orderly production workshop and experienced skilled workers, and has passed ISO9001 quality management system certification, with the environment and experience for high-precision equipment production and processing. At the same time, it has integrated upstream and downstream supply chain resources and has the ability to deliver large quantities in a short time. Standardized management ensures the delivery quality of equipment.
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