Current Category:
Subcategory:
Brand:
- Exfo
- ColorSpace
- Crystro
- EngWx
- Eoulu
- Fibretop
- Focuslight
- HbSais
- Inficon
- Innolite
- Keyence
- Koc
- KonicaMinolta
- Kyky
- Laserx
- Micro-Epsilon
- Mvotem
- PhenixOptics
- Slamtec
- Sri-I
- Ulirvision
- UlvacShanghai
- Uwlaser
- Vitalchem
- WekonTech
- Whhxykj
- WhPrecise
- Ybsemi-Solution
- Zzqsjm
- Burkert
- Trumpf
- OsakaVacuum
- NtiNanofilm
Photonics Source provides 744 products. Download datasheets, request quotes, and compare function, price, and availability.
-
TruLaser Tube
Max Power (kW): 2, 3, 4, 6 Average Power Input (kW): 6, 9, 10, 12 Max Material Thickness (Mild Steel) (mm): 8, 10, 14 Max Material Thickness (Stainless Steel) (mm): 4, 5, 6, 10 Max Material Thickness (Aluminum) (mm): 4, 6, 6, 10 -
TruLaser Tube
Max Power: 2kW-6kW Average Power Input: 6kW-12kW Max Material Thickness (Mild Steel): 8mm-14mm Max Material Thickness (Stainless Steel): 4mm-10mm Max Material Thickness (Aluminum): 4mm-10mm -
TruLaser Tube
Max Power (kW): 2, 3, 4, 6 Average Power Input (kW): 6, 9, 10, 12 Max Material Thickness - Mild Steel (mm): 8, 10, 14 Max Material Thickness - Stainless Steel (mm): 4, 5, 6, 10 Max Material Thickness - Aluminum (mm): 4, 6, 10 -
TruBend Center 7030
Maximum Bending Capability: 3mm Maximum Nesting Height: 350mm Drive Technology: Low-maintenance wedge drive Part Manipulator Axes: 2-axis Rotation Unit: Included -
TruBend Series 8000
Maximum Pressure: 6000kN/m Maximum Length: 6.10m Maximum Weight: 600t Tool Indicator: Available Offline Programming: Available -
TruBend Series 3000
Number of Axes: 4 Backgauge Axes: Upgradable to 5-axis Installation Height: 615mm Smart C-Frame: Yes Hydraulic System: On-Demand -
TruStore 1030
Storage Capacity: Up to 2.5 tons per cassette Number of Cassettes: Up to 10 Maximum Sheet Size: 3000mm x 1500mm Maximum Sheet Thickness: 25mm System Height: Up to 6.5m -
P Series ALD Platform
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer 3D substrates Vacuum Chamber Size: ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm with 23 shelf cassette, 370×470×25mm with 2 shelf cassette (P400A); 550×310×700mm, 380×380×900mm, 730×1200×10mm (P800); 1300×2400×750mm (P1500) -
P Series ALD Systems
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer 3D substrates Vacuum Chamber Size: ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm with 23 shelf cassette, 370×470×25mm with 2 shelf cassette (P400A); 550×310×700mm, 380×380×900mm, 730×1200×10mm (P800); 1300×2400×750mm (P1500) -
TFS Series
Process Type: Thermal ALD Process Type: PEALD Substrate Type TFS200: 200×200mm 3D components, powder materials Substrate Type TFS500: 300×370×470mm glass substrates, 3D components, powder materials Substrate Loading: Automatic -
TFS Series
Process Type: Thermal ALD Process Type: PEALD Substrate Type TFS200: 单片200mm 200×200mm 3D部 Items 粉状材料 Substrate Type TFS500: 单片300mm 单片370×470mm玻璃基底材料 3D部 Items/粉状材料 Substrate Loading: 自动, 手动 -
SRII-300
Dimensions: 7.52×3.19×3.08m Wafer Size: 200mm/300mm Species: B/P/As (expandable) Application: Logic/Memory/Power/CIS etc. Energy Range: 2-900keV -
SRII Ion Implanter Series
Product: SRII-60, SRII-200, SRII-1.5M, SRII-4.5M SiC, SRII-200 SiC, SRII-300 SiC, SRII-4.5M, SRII-8M, SRII-300 Dimensions: 6.48×2.76×3.06m, 6×3×3.06m, 9.2×4.2×3m, 8.03×4.6×2.86m, 6×3×3.06m, 7.52×3.19×3.08m, 8.9×4.2×2.86m, 9.7×4.4×2.86m, 7.52×3.19×3.08m Wafer Size: 200mm/300mm, 150mm/200mm Species: H/He, Al/N/B/P/As, B/P/As Application: SOI materials, semiconductor devices, power devices, SiC, logic/memory/power/CIS -
SRII-300
Dimensions: 7.52×3.19×3.08m Wafer Size: 200mm/300mm Species: B/P/As (expandable) Application: Logic/Memory/Power/CIS etc. Energy Range: 2-900keV -
SRII Ion Implanter Series
Product: SRII-60, SRII-200, SRII-1.5M Dimensions: 6.48×2.76×3.06m, 6×3×3.06m, 9.2×4.2×3m Wafer Size: 200mm/300mm Species: H/He Application: SOI materials -
SRII Ion Implanter Series
Dimensions SRII-60: 6.48×2.76×3.06m Dimensions SRII-200: 6×3×3.06m Dimensions SRII-1.5M: 9.2×4.2×3m Dimensions SRII-4.5M: 8.9×4.2×2.86m Dimensions SRII-8M: 9.7×4.4×2.86m -
SRII MCI Ion Implanter
Dimensions: 7.52×3.19×3.08m Wafer Size: 200mm/300mm Species: B/P/As (expandable) Application: Logic/Memory/Power/CIS etc. Energy Range: 2-900keV -
P Series
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer 3D objects Vacuum Chamber Size: ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm with 23 shelf cassette, 370×470×25mm with 2 shelf cassette (P400A); 550×310×700mm, 380×380×900mm, 730×1200×10mm (P800); 1300×2400×750mm (P1500) -
P Series ALD Platform
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer 3D substrates Vacuum Chamber Size: ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm (P400A), 550×310×700mm (P800), 1300×2400×750mm (P1500) -
P Series ALD Platform
Process Type: Thermal ALD Process Temperature Range: 25-550°C Substrate Type: Silicon wafers, glass, metal materials, polymer 3D objects Vacuum Chamber Size: ø400mm (P400A), ø800mm (P800), ø1700mm (P1500) Reaction Chamber Loading and Size: 240×240×720mm with 23 shelf cassette, 370×470×25mm with 2 shelf cassette (P400A); 550×310×700mm, 380×380×900mm, 730×1200×10mm (P800); 1300×2400×750mm (P1500)