UV Debonding Machine

UV Debonding Machine

Supplier
Zzqsjm
Category
Semiconductor Manufacturing Equipment
Origin
China

Product model: QSP-12A

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Overview

Product model: QSP-12A

Specifications

ParameterValue
Equipment ModelQSP-12A
Workpiece Size12mm
LED TypeLED 365nm
Irradiation Power Range400 mw/cm ²
Optional Voltage100-240VAC 50/60HZ
Outline Dimensions480x580x420 (mm)

Applications

UV UV Debonding Machine Wafer, Glass Ceramic. Package, Optical Lens, LED, IC, Material UV Film

Key Features

Control Method, I/O, 0-10V PLC, Control Method Automatic. 1/10

Datasheet

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Supplier Information

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Zzqsjm
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<p>Since its establishment in 2014, Qisheng Precision has been focusing on the semiconductor and precision manufacturing industry, specializing in R&D and manufacturing of dicing equipment, superhard tools, and precision grinding products. It is one of the few high-tech enterprises in China that truly achieves dual-track independent R&D of "equipment + tools". Core strengths: integrated R&D and manufacturing, three business divisions, full-chain capability; professional R&D team mastering core technologies. Core products: precision dicing machines, full series of dicing blades (electroformed, resin, metal), precision grinding products (thinning wheels, ceramic chucks, etc.). Applications: integrated circuits, LED chips, optical components, new energy batteries, electronic ceramics, magnetic materials. Served thousands of enterprises across 30 provinces. Vision: Perseverance, proactiveness, harmonious work, self-transcendence; striving for innovation and precision.</p>

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UV Debonding Machine
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