Cleaning Machine

Cleaning Machine

Supplier
Zzqsjm
Category
Material-based Production Equipment
Origin
China

Product model: QSW-12A

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Overview

Product model: QSW-12A

Specifications

ParameterValue
Equipment ModelQSW-12A
Wafer Dimensions12
Rotational Speed100-2500 r/Min
/ Time0-999 Sec
Cleaning Nozzle Speed1-37.59/sec
Air Supply Pressure0.5-0.6 MPa
Water Supply Pressure0.2-0.4 MPa
Dimensions x x500x645×1430 mm
Machine Weight150 Kg

Applications

Wafer, Silicon Wafer, Ceramic, QFN Material, /

Key Features

Dimensions, Wafer Dimensions; Rotational Speed

Datasheet

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Supplier Information

Zz
Zzqsjm
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<p>Since its establishment in 2014, Qisheng Precision has been focusing on the semiconductor and precision manufacturing industry, specializing in R&D and manufacturing of dicing equipment, superhard tools, and precision grinding products. It is one of the few high-tech enterprises in China that truly achieves dual-track independent R&D of "equipment + tools". Core strengths: integrated R&D and manufacturing, three business divisions, full-chain capability; professional R&D team mastering core technologies. Core products: precision dicing machines, full series of dicing blades (electroformed, resin, metal), precision grinding products (thinning wheels, ceramic chucks, etc.). Applications: integrated circuits, LED chips, optical components, new energy batteries, electronic ceramics, magnetic materials. Served thousands of enterprises across 30 provinces. Vision: Perseverance, proactiveness, harmonious work, self-transcendence; striving for innovation and precision.</p>

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