Indium Antimonide InSb
InSb III-V,Very Narrow Gap/Low Effective Electron Mass/High Mobility for Magnetoresistance/Hall Devices;High3–5μm QE/Responsivity,Preferred MWIR Detector Material.
Specification Snapshot
Diameter [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 2″]
50.5±0.5
Thickness [Crystal2″,Not Model;Custom Wafer;800 or900±25 Tolerance Allocation Not Guessed;Size2″]
625±25
Diameter [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 3″]
76.2±0.4
Thickness [Crystal3″,Not Model;Custom Wafer;800 or900±25 Tolerance Allocation Not Guessed;Size3″]
800 or 900±25
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Overview
InSb III-V,Very Narrow Gap/Low Effective Electron Mass/High Mobility for Magnetoresistance/Hall Devices;High3–5μm QE/Responsivity,Preferred MWIR Detector Material.
Specifications
| Parameter | Value |
|---|---|
| Crystal Orientation [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 2″] | (111) A or B ±0.1° Crystal Orientation; (100) Also Available at Any Angle off the (100) Growth Plane |
| Diameter [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 2″] | 50.5±0.5 |
| Plane Angle [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 2″] | 2 Flats at 120° |
| Angular Tolerance [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 2″] | ±0.1 ° |
| Major-Side Length [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 2″] | 16±2 |
| Minor-Side Length [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 2″] | 8±1 |
| Thickness [Crystal2″,Not Model;Custom Wafer;800 or900±25 Tolerance Allocation Not Guessed;Size2″] | 625±25 |
| Doping [Source Crystal Size 2″, Not Product Model; Custom Wafer Dimensions; Electrical/Doping Specifications; Size 2″] | Te-Doped |
| Conductivity Type [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 2″] | n-Type |
| Carrier Concentration [Source Crystal Size 2″, Not Product Model; Wafer Dimensions Customizable; 77K; Size Specification 2″] | 4×10¹⁴~1.4×10¹⁵ |
| Electron Mobility [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 2″] | ≥1×10⁶ |
| Dislocation Density [Crystal2″,Not Model;Custom Wafer;Electrical Table Explicitly Common2″/3″;Stricter Electrical Specs on Request;Size2″] | ≤50 cm⁻² |
| TTV [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Polished/Etched; Size Specification 2″] | <10 μm |
| Bow [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Polished/Etched; Size Specification 2″] | <10 μm |
| Warp [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Polished/Etched; Size Specification 2″] | <15 μm |
| TTV [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Polished/Polished; Size Specification 2″] | <5 μm |
| Bow [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Polished/Polished; Size Specification 2″] | <5 μm |
| Warp [Original Crystal Size Specification 2″; Not a Product Model; Wafer Size Customizable on Request; Polished/Polished; Size Specification 2″] | <8 μm |
| Crystal Orientation [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 3″] | (111) A or B ±0.1° Crystal Orientation; (100) Also Available at Any Angle off the (100) Growth Plane |
| Diameter [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 3″] | 76.2±0.4 |
| Plane Angle [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 3″] | 2 Flats at 120° |
| Angular Tolerance [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 3″] | ±0.1 ° |
| Major-Side Length [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 3″] | 22±2 |
| Minor-Side Length [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 3″] | 11±1 |
| Thickness [Crystal3″,Not Model;Custom Wafer;800 or900±25 Tolerance Allocation Not Guessed;Size3″] | 800 or 900±25 |
| Doping [Source Crystal Size 3″, Not Product Model; Custom Wafer Dimensions; Electrical/Doping Specifications; Size 3″] | Te-Doped |
| Conductivity Type [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 3″] | n-Type |
| Carrier Concentration [Source Crystal Size 3″, Not Product Model; Wafer Dimensions Customizable; 77K; Size Specification 3″] | 4×10¹⁴~1.4×10¹⁵ |
| Electron Mobility [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Size Specification 3″] | ≥1×10⁶ |
| Dislocation Density [Crystal3″,Not Model;Custom Wafer;Electrical Table Explicitly Common2″/3″;Stricter Electrical Specs on Request;Size3″] | ≤50 cm⁻² |
| TTV [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Polished/Etched; Size Specification 3″] | <10 μm |
| Bow [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Polished/Etched; Size Specification 3″] | <10 μm |
| Warp [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Polished/Etched; Size Specification 3″] | <15 μm |
| TTV [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Polished/Polished; Size Specification 3″] | <5 μm |
| Bow [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Polished/Polished; Size Specification 3″] | <5 μm |
| Warp [Original Crystal Size Specification 3″; Not a Product Model; Wafer Size Customizable on Request; Polished/Polished; Size Specification 3″] | <8 μm |
Applications
Outdoor Observation; Search and Rescue; Circuit Inspection; Smart Warehousing; Critical-Site Security; Fire Early Warning; Fishing Prohibition Enforcement; Forest Fire Prevention; Straw-Burning Prohibition Enforcement; Photovoltaics; Wind Power; Lithium Batteries; Steel; Petrochemicals; Electric Power; Assisted Driving; Chemicals; Building HVAC; Perimeter Protection; Fire Monitoring
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Supplier Information
Guangzhi Technology Co., Ltd. (300489) is a leading national high-tech enterprise in optoelectronic technology, with an integrated infrared industry chain covering material growth, chip design, and system integration. Products include infrared materials, MEMS chips, detectors, core modules, lenses, thermal imagers and optoelectronic systems, widely used in AI, semiconductors, new energy, medical testing, outdoor night vision, industrial temperature measurement, machine vision, environmental protection, drone payloads, and assisted driving.
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