Single-Crystal Diamond
Diamond:Tetrahedrally Packed Carbon,Extremely Hard,Excellent Thermal Conductivity/Broad Optical Transparency,Hardest Known Natural Material,Also Synthesized at High Pressure/Temperature.
Specification Snapshot
Single-Crystal Diamond - Diameter
5 mm × 5 mm
Single-Crystal Diamond - Diameter
10 mm × 10 mm
Single-Crystal Diamond - Diameter
20 mm × 20 mm
Single-Crystal Diamond - Diameter
1 inch - 25.4mm
Single-Crystal Diamond - Thickness
0.3~0.5mm
Single-Crystal Diamond - Wafer Condition
Ground, Double-Side Polished, Single-Side Polished
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Overview
Diamond:Tetrahedrally Packed Carbon,Extremely Hard,Excellent Thermal Conductivity/Broad Optical Transparency,Hardest Known Natural Material,Also Synthesized at High Pressure/Temperature.
Specifications
| Parameter | Value |
|---|---|
| Single-Crystal Diamond - Diameter | 5 mm × 5 mm |
| Single-Crystal Diamond - Diameter | 10 mm × 10 mm |
| Single-Crystal Diamond - Diameter | 20 mm × 20 mm |
| Single-Crystal Diamond - Diameter | 1 inch - 25.4mm |
| Single-Crystal Diamond - Thickness | 0.3~0.5mm |
| Single-Crystal Diamond - Crystal Orientation | <100><110><111> |
| Single-Crystal Diamond - Growth Method | Microwave Plasma Chemical Meteorological Deposition MPCVD (Source Wording: 化学气象沉积) |
| Single-Crystal Diamond - Wafer Condition | Ground, Double-Side Polished, Single-Side Polished |
| Single-Crystal Diamond - Polished Roughness (AFM, 5*5μm) | 1~10nm |
| Single-Crystal Diamond - Thermal Conductivity | 1500-2300W/m.K |
| Diamond - Crystal Structure | Cubic Crystal |
| Diamond - Bandgap | 5.47eV |
| Diamond - Melting Point | 4027℃ |
| Diamond - Mohs Hardness | 10 mohs |
| Diamond - Thermal Conductivity | 20W·cm⁻¹·℃⁻¹ |
| Diamond - Thermal Expansion Coefficient | 0.8×10⁻⁶ |
| Diamond - Lattice Constant | 0.3567 nm |
| Diamond - Electron Mobility | 1600 cm⁻²·V⁻¹·s⁻¹ |
| Diamond - Breakdown Electric Field | 10 MV·cm⁻¹ |
| Diamond - JFM Index (Power) | 5330 |
| Diamond - BFM Index (SW) | 14860 |
| Diamond - BHFM Index (RF) | 1080 |
| Diamond - Refractive Index | 2.417 |
Applications
Diamond Is Widely Used in Cutting, Drilling and Grinding, and in High-Technology Applications Including Heat Dissipation for High-Power Electronics, Quantum Computing and Optical Windows. Its Excellent Physical Properties Also Support Use in Biosensors, Medical Devices and High-End Jewelry Manufacturing.
Datasheet
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Supplier Information
Jiangyin Jingmu Optoelectronic New Materials Co., Ltd. is a technology-oriented enterprise dedicated to semiconductor wafer material processing and epitaxial technology. With a decade of focus on semiconductor substrates, including SiC, sapphire, silicon, and third/fourth-generation materials like diamond, GaN, Ga2O3, AlN, it also provides optical wafers and carrier products. Equipped with advanced processing technologies such as cutting, grinding, polishing, laser processing, epitaxial coating, and wafer bonding, it collaborates with universities for R&D, offering customized solutions. Products are widely used in LED, power devices, RF, and optical communication.
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