Diamond Substrate
Diamond's thermal conductivity at room temperature can reach 2200W/mK, 5 times that of Cu. Used to cool RF, optoelectronic and power chips, it greatly improves chip power, life and stability. We offer single-crystal and polycrystalline diamond heat-spreader substrates, along with metallization and soldering solutions.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Thermal Conductivity [Single Crystal] | 2000W/mK |
| Dimensions [Single Crystal] | 5*5mm-20*20mm |
| Thickness [Single Crystal] | 0.15-3mm |
| Thermal Conductivity [Polycrystalline] | 1200-2000W/mK |
| Dimensions [Polycrystalline] | 2 Inches/3 Inches |
| Thickness [Polycrystalline] | 0.1-1mm |
Datasheet
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