1.6T DR8 Thin-film Lithium Niobate Mach-Zehnder Modulator Chip
Specification Snapshot
Storage temperature Ts
min:-40 °C; max:85 °C
Operating temperature
min:-10 ℃; max:85 ℃
Heater maximum current
max:30 mA
Insertion loss IL [Modulation loss not included. Assume 1.25dB coupling loss per facet, 9.5 dB splitting loss. Without modulation, at in-phase condition, 3dB modulator loss. 1.25*2+9.5+3=15 dB.]
max:15.5 dB
Wavelength range
min:1300 nm; typical:1310 nm; max:1320 nm
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Specifications
| Parameter | Value |
|---|---|
| Storage temperature Ts | min:-40 °C; max:85 °C |
| Storage Relative humidity RH | min:0 %; max:90 % |
| Operating temperature | min:-10 ℃; max:85 ℃ |
| RF electrode maximum Voltage V_(RF) | max:4 V |
| Heater maximum current | max:30 mA |
| Heater maximum voltage | max:8 V |
| RF Vpi V_(pi_RF) | typical:2.8 V; max:3 V |
| Insertion loss IL [Modulation loss not included. Assume 1.25dB coupling loss per facet, 9.5 dB splitting loss. Without modulation, at in-phase condition, 3dB modulator loss. 1.25*2+9.5+3=15 dB.] | max:15.5 dB |
| IL Uniformity D_(IL) | max:1.5 dB |
| Electro-optical 3-dB Bandwidth BW | min:67 GHz |
| Characteristic impedance Z_(c) | min:45 Ohm; typical:50 Ohm; max:55 Ohm |
| Heater resistance | min:180 Ohm; typical:220 Ohm; max:260 Ohm |
| Thermal tuning Ppi P_(pi_th) | typical:50 mW/π; max:60 mW/π |
| Wavelength range | min:1300 nm; typical:1310 nm; max:1320 nm |
| Optical Extinction ratio OER | min:20 dB; typical:25 dB |
| Optical Return Loss RL | min:26 dB |
| Input and output mode diameter | min:3.5 μm; typical:4 μm |
| Input MPD splitter ratio | min:0.5 %; typical:1.5 %; max:2 % |
| Output MPD splitter ratio | min:15 %; typical:20 %; max:25 % |
Key Features
● Based on cutting-edge thin-film Lithium Niobate (TFLN) technology; ● Low Vpi for driverless operation; ● Small formfactor ● Low insertion loss; ● Spot-size inverters integrated. ● Support single LD input or dual LD input. ● Ori-chip’s proprietary design, designed and fabricated by Ori-Chip.
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Supplier Information
Founded in 2018, Ori-Chip Optoelectronics Technology Co. Ltd., is dedicated to make the state-of-the-art photonic integrated circuits, including both InP and thin-film lithium niobate platforms. Our main products include:
full C-band Widely-tunable lasers,Thin-film lithium niobate MZM modulators,and DFB laser diodes for both fiber optic communication and sensing.
Using the cutting-edge InP and thin-film lithium niobate technology, our products deliver the best performance at competitive price. We hold multiple IPs, including patents from both China and the United States.
All of our products are made in-house by ORI-CHIP wafer fabs.
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