Home All Products Optomechanics & Accessories Accessories ZLP20B/22B/25B/28B Smart Ring Thrower (Blubber Ring Throw)
ZLP20B/22B/25B/28B Smart Ring Thrower (Blubber Ring Throw)
Accessories

ZLP20B/22B/25B/28B Smart Ring Thrower (Blubber Ring Throw)

Supplier
Xboecn
Category
Accessories
Origin
China

The machine bed is a fine-simplified polishing device for flat-cracking elements such as high-precision optical, electronic, ceramic, silicon chips, mechanical parts, etc. The machine-bed PLC digital program control mode allows for independent control of various operating procedures, which have the ability to operate at a minimum speed, time control, count control, sequence control, remote fail alerts, etc. for the various transmission systems.

Specification Snapshot
Dimensions [Parameter graphs 1.png; ZLP20B column; specification table text rows]
3000 mm × 3500 mm × 1600 mm
Dimensions [Parameter 1.png; ZLP22B column; specification table text rows]
3200 mm × 3700 mm × 1600 mm
Dimensions [Parameter graphs 1.png; ZLP25B column; specification table text rows]
3900 mm × 3700 mm × 1900 mm
Dimensions [Parameter graphs 1.png; ZLP28B column; specification table text rows]
4300 mm × 3800 mm × 1800 mm
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Overview

The machine bed is a fine-simplified polishing device for flat-cracking elements such as high-precision optical, electronic, ceramic, silicon chips, mechanical parts, etc. The machine-bed PLC digital program control mode allows for independent control of various operating procedures, which have the ability to operate at a minimum speed, time control, count control, sequence control, remote fail alerts, etc. for the various transmission systems.

Specifications

ParameterValue
Graft size (gravitate) [Parameters 1.png; ZLP20B column]Φ2000
Project Ring Size [Parameter graphs 1.png; ZLP20B column; source unmarked units]Φ800 × Φ650 × 70
Single Point [Parameters 1.png; ZLP20B column]≤0.01 mm
On-board beat [Parameters 1.png; ZLP20B column]≤0.08 mm
Correct Disk Specification [Parameters 1.png; ZLP20B column]Φ1050 mm × 110 mm
The grinder's turning speed. [Parameter graph 1.png; ZLP20B column; server infinity; source retention]0,0.8～3
Processing Range [Parameters 1.png; ZLP20B column]≤Φ650
PLC interface [Parameters 1.png; ZLP20B column]MH1500-1(15")
Cracket moving distance [Parameters 1.png; ZLP20B column]≤200～250 mm
Total machine-bed power [Parameters 1.png; ZLP20B column; 380V]12.5 kW
Machine bed weight [Parameters 1.png; ZLP20B column]Approximately 8500
Dimensions [Parameter graphs 1.png; ZLP20B column; specification table text rows]3000 mm × 3500 mm × 1600 mm
Graft size (gravitate) [Parameters 1.png; ZLP22B column]Φ2200
Project Ring Size [Parameters 1.png; ZLP22B column; source unmarked units]Φ850 × Φ700 × 70
Single Point [Parameters 1.png; ZLP22B column]≤0.01 mm
On-board beat [Parameters 1.png; ZLP22B column]≤0.10 mm
Correct Disk Specification [Parameters 1.png; ZLP22B column]Φ1150 mm × 110 mm
The grinder's turning speed. [Parameter graph 1.png; ZLP22B column; server infinity; source retention]0,0.8～3
Processing Range [Parameters 1.png; ZLP22B column]≤Φ700
PLC interface [Parameters 1.png; ZLP22B column]MH1500-1(15")
Cracket moving distance [Parameters 1.png; ZLP22B column]≤200～250 mm
Total machine-bed power [Parameters 1.png; ZLP22B column; 380V]13 kW
Machine bed weight [Parameters 1.png; ZLP22B column]Approximately 11000
Dimensions [Parameter 1.png; ZLP22B column; specification table text rows]3200 mm × 3700 mm × 1600 mm
Graft size (gravitate) [Parameters 1.png; ZLP25B column]Φ2500
Project Ring Size [Parameter graphs 1.png; ZLP25B column; source unmarked units]Φ950 × Φ750 × 70
Single Point [Parameters 1.png; ZLP25B column]≤0.01 mm
On-board beat [Parameters 1.png; ZLP25B column]≤0.10 mm
Correct Disk Specification [Parameters 1.png; ZLP25B column]Φ1310 mm × 110 mm
The grinder's turning speed. [Parameter graph 1.png; ZLP25B column; server infinity; source retention]0,0.8～3
Processing Range [Parameters 1.png; ZLP25B column]≤Φ750
PLC interface [Parameters 1.png; ZLP25B column]MH1500-1(15")
Cracket moving distance [Parameters 1.png; ZLP25B column]≤200～250 mm
Total machine-bed power [Parameters 1.png; ZLP25B column; 380V]16 kW
Machine bed weight [Parameters 1.png; ZLP25B column]Approximately 10000
Dimensions [Parameter graphs 1.png; ZLP25B column; specification table text rows]3900 mm × 3700 mm × 1900 mm
Graft size (gravitate) [Parameters 1.png; ZLP28B column]Φ2800
Project Ring Size [Parameter 1.png; ZLP28B column; source unmarked units]Φ1100 × Φ900 × 80
Single Point [Parameters 1.png; ZLP28B column]≤0.015 mm
On-board beat [Parameters 1.png; ZLP28B column]≤0.10 mm
Correct Disk Specification [Parameters 1.png; ZLP28B column]Φ1480 mm × 110 mm
The grinder's turning speed. [Parameter graph 1.png; ZLP28B column; server infinity; source retention]0,0.8～2
Processing Range [Parameters 1.png; ZLP28B column]≤Φ900
PLC interface [Parameters 1.png; ZLP28B column]MH1500-1(15")
Cracket moving distance [Parameters 1.png; ZLP28B column]≤280 mm
Total machine-bed power [Parameters 1.png; ZLP28B column; 380V]16 kW
Machine bed weight [Parameters 1.png; ZLP28B column]Approximately 11800
Dimensions [Parameter graphs 1.png; ZLP28B column; specification table text rows]4300 mm × 3800 mm × 1800 mm

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Supplier Information

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Xboecn
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Xibin Optoelectronics, full name Xibin Optoelectronics (Jiangsu) Co., Ltd. (established in June 2001 as Wuxi Xibin Optoelectronic Equipment Factory, changed to Wuxi Xibin Optoelectronic Equipment Co., Ltd. in April 2007, established Yancheng Xibin Optoelectronic Technology Co., Ltd. in April 2012, changed to Xibin Optoelectronics (Jiangsu) Co., Ltd. in 2021, and established an optical processing workshop at the end of 2021), is a high-tech enterprise specializing in the research and development, manufacturing and sales of optical cold processing equipment, as well as supporting processing technology and processing devices. Xibin Optoelectronics has a well-trained, dedicated, and challenge-driven professional technical R&D team. It has long focused on product innovation and has received on-site guidance from Academician Pan Junhua and others. Main products: intelligent ring polishing machine series, CNC single-axis flipping machine series, pneumatic flat swing precision grinding and polishing machine series, high-speed fine grinding and polishing machine series, variable frequency multi-axis machine series, cylindrical grinding and polishing machine series, intelligent surface milling machine, fully automatic wafer chamfering machine, chamfering machine, centrifuge, etc. Product application: suitable for fine grinding and polishing of flat, cylindrical and spherical surfaces of materials such as glass, ceramics, sapphire, silicon wafers, mechanical seals, etc. Technology leadership, reliable quality, and customer satisfaction are the company's purposes. We warmly welcome friends from all walks of life to visit and negotiate, let us work together and develop together! Xibin Optoelectronics is willing to be your trusted partner!

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