Sputtering Metalized Fiber
A metal film is deposited on the fiber surface by sputtering process. Metalized fiber can be soldered into a package to achieve hermetical sealing and provide high environmentally reliable interconnection for optical devices. The metalized fiber is widely used in passive and active devices. Applications
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Overview
Specifications
| Parameter | Value |
|---|---|
| Film Composition | Ti/Ni/Au (other materials available on request) |
| Coating Thickness | 100-1000 (other thickness available on request) |
| Plating Length Tolerance | ±1 mm |
| Polarization Extinction Ratio [PM fiber type only] | ≥20 dB |
| Recommended Minimum Bend Diameter | 25 mm |
| Helium Leak Rate | ≤1.0×10⁻⁹ |
| Pull Strength | ≥5 N |
| Fiber Length Tolerance | ±10 or specify |
| Recommended Soldering Temperature | <300 °C |
| Recommended Soldering Time [Source unit printed uppercase S] | <3 S |
| Storage Temperature | -40 to +85 °C |
| Metallization Availability [Actual Specifications footnote] | Single or dual zone; mid-span available |
Applications
Key Features
Datasheet
Supplier Information
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