Bump& Cooper Pilar Test
In the Clip Advanced Encapsulation Process, the bumper points are used to connect chips to external circuits. However, during the Bump production process, deficiencies in the cam height, loss of cams, and location deviations may result in the electrical performance of the chip and external connection, which will affect the electrical performance of the chip. Traditional 2D detection techniques will not be able to identify a target height, so that the tests for Bump, Cooper Pilar will need to be tested on the basis of an image program based on 3D, which will help to improve quality control in manufacturing, reduce waste productivity and increase productivity efficiency. The solution is: in the WippTornado series, the results of the detection of the DIE are derived from the Map map, Bump heat map, and each DDID data, based on scanning methods, and will result in the imaging scanning of the whole film on Wafer, and the results of the detection of the DIE values are based on software algorithms, which will be derived from the Map, Bump heat map, and each DIGD data; and the details of the data are available on the basis of the DIQD.
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