MEMS 1xN single-mode light switch
MEMS 1xN single-light switches of the Guilin Lumonic Technology Group Inc. are based on MEMS technology and have small-scale sealing, high stability, high reliability, non-geled light circuits, non-locking features that can be applied to the DWDM network, channel monitors, laboratory research, and configuration of OADM systems.
Specification Snapshot
Wavelength Range [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM]
1260~1650 nm
Return Loss [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM]
≥45 dB
Cross Talk [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM]
≥50 dB
Power Consumption [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM]
≤500 mW
Operating Temperature [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM]
-5~+70 ℃
Storage Temperature [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM]
-40~+85 ℃
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Overview
MEMS 1xN single-light switches of the Guilin Lumonic Technology Group Inc. are based on MEMS technology and have small-scale sealing, high stability, high reliability, non-geled light circuits, non-locking features that can be applied to the DWDM network, channel monitors, laboratory research, and configuration of OADM systems.
Specifications
| Parameter | Value |
|---|---|
| Wavelength Range [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | 1260~1650 nm |
| Test Wavelength [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | 1310/1550 |
| Insertion Loss [N≤8; not containing connect headers for the above parameters; SUN-MS-S1-1XN (≤32)-SM] | 0.6(TYP) 1.0(MAX) N≤8 |
| Insertion Loss [N≤16; not containing connect headers for the above parameters; SUN-MS-S1-1XN (≤32)-SM] | 1.0(TYP) 1.6(MAX) N≤16 |
| Insertion Loss [N≤32; not containing connect headers for the above parameters; SUN-MS-S1-1XN (≤32)-SM] | 1.6(TYP) 1.8(MAX) N≤32 |
| WDL [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | ≤0.3 dB |
| PDL [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | ≤0.15 dB |
| TDL [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | ≤0.3 dB |
| Return Loss [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | ≥45 dB |
| Cross Talk [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | ≥50 dB |
| Repeatability [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | ≤±0.05 |
| Power Supply [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | 4.8~12.5 V |
| Power Consumption [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | ≤500 mW |
| Lifetime [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | ≥10⁹ |
| Switching Time [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | ≤20 ms |
| Transfer Power [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | ≤500 mW |
| Operating Temperature [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | -5~+70 ℃ |
| Storage Temperature [The above parameters do not contain connect headers; SUN-MS-S1-1XN (≤32)-SM] | -40~+85 ℃ |
| Package Dimensions [Type A; not including connect headers for the above parameters; SUN-MS-S1-1XN (≤32)-SM] | Type A: 39.1(L) x 24.7(W) x 11(H) ±0.2 |
| Package Dimensions [Type B; not containing connect headers for the above parameters; SUN-MS-S1-1XN (≤32)-SM] | Type B: 65(L) x 24.7(W) x 11(H) ±0.2 |
| Package Dimensions [Type C; not including connect headers for the above parameters; SUN-MS-S1-1XN (≤32)-SM] | Type C: 37(L) x 21(W) x 10(H) ±0.2 with 14PIN |
| Light Switch Type [SUN-MS-S1-1XN(≤32)-SM] | MEMS |
| Form Factor [SUN-MS-S1-1XN(≤32)-SM] | Module |
| Port Configuration [SUN-MS-S1-1XN(≤32)-SM] | 1xN |
Applications
DWDM Network Channel Monitor Laboratory Research Dynamic Configuration Interpolation Reuse System Photo-sensor, Light Monitor
Key Features
Based on MEMS technology, small containment, high stability, high reliability, light-circuit non-locking state.
Datasheet
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Supplier Information
Founded in 2001, Guilin GLSUN Science and Tech Group Co., Ltd. is a professional semiconductor optical chip full-process service provider in China. The company focuses on the integration of optoelectronic technology and intelligent computing, continuously innovating in core fields such as optical chips, optical switches, and optical isolators, while building comprehensive capabilities covering epitaxy, chip manufacturing, packaging, and testing.
In the era of AI and big data, GLSUN is strategically focused on computing networks and data center applications, providing high-speed, low-power, and highly reliable optical interconnection solutions for general computing, supercomputing, and AI computing scenarios. Our core products include optical circuit switches OCS, MEMS optical switches, optical isolators and optical chips, while also advancing cutting-edge technologies such as WSS and thin-film lithium niobate chips.
With strong in-house R&D and large-scale manufacturing capabilities, GLSUN is accelerating its transformation from a traditional optical communications company into an intelligent photonics innovation platform, supporting the next generation of digital infrastructure and AI computing development.
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