XY Bonding Machine
This equipment is primarily designed to address the problem of glue on resin bars during crystal-directed adhesion, addressing the problem of the relative accuracy of the adhesive, the spilling of the adhesive and the inaccurateness of the mixture of glue.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Small amount of glue | 0.01 ml |
| Mixed Precision Differing | ±1 % |
Applications
Datasheet
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