Four-Axis Grinding Machine XH-1
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Specifications
| Parameter | Value |
|---|---|
| Target Pellet Processing Diameter Range | 0.8mm~3.0mm |
| Target Pellet Grinding and Polishing Roundness | better than 0.3μm |
| Target Pellet Grinding and Polishing Surface Roughness | better than 20nm |
| Four-Axis Axis-to-Center Alignment [Both axes 109.5°; deviation <0.1°] | Inverted regular tetrahedral distribution, angle between the two axes 109.5°; deviation ＜0.1° |
| Four-Axis Motion Accuracy along the Axes | Vertical runout 8μm/10mm; horizontal runout ＜8μm/10mm |
| Four-Axis Rotation Accuracy | 0mm~20nm, Accuracy ＜20μm |
| Four-Axis Rotational Speed | 0r/min~3000r/min Adjustable |
| Four-Axis Relative Time Difference [Accuracy <0.5s] | 5s-30s, Accuracy ＜0.5s |
| Grinding Pressure [Adjustable; pressure accuracy is 5% of full scale] | 0N-5N adjustable; pressure accuracy is 5% of full scale |
| Continuous Operating Duration | ＞100h |
| Drive Method | Servo motor drive |
| Transmission Method [Accuracy 1μm/0.1μm (1/10 subdivision)] | Precision guide-rail translation stage; accuracy 1μm/0.1μm (1/10 subdivision) |
| Operating Method | Independent rotation direction control for all four axes; timed reversal can be set |
| Control Method | Force-feedback control, controlled by the host-computer human-machine interaction program |
| Monitoring Method | Real-time monitoring with a microscope objective and a high-definition camera |
| Power Supply [AC] | AC220V，50/60Hz |
| Power Consumption [Peak] | Peak ＜1200W |
| Dimensions | 1080 mm × 850 mm × 1658 mm |
| Weight | 400kg |
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For blade-stabbing and blade-opening. ， New knives need to be installed and polished. ， Correct the shape of the blade and the blade. 。 In the drawing process. ， Slashes need to be mended regularly ， Make sure the blades are sharp. 。 1. The use of a sharpener. r A razor plate can be replaced. Wafer Fakes are for grinding. Dicing Blade r Compared to traditional use Silicon Wafer The sharpener. ， Significant increase in the efficiency of cutting machines r It'll only take a few minutes. ， I can finish the sharpening blade. ， And saving material costs by increasing cutting efficiency. 2. Why use a sharpener? ？ r The sharpener plate can be new. Wafer Dicing Blade Pre-use to increase the sharpness of blades r Install new blades → A sharpener. → Cut Wafer r- After the new blades were sharpened ， Makes Diamond The surface is flat. ， r And thus prevent Wafer Cutting the edges or cracks. 3. Advantages —— Cost savings Compared to tradition Silicon Wafer The way to cut the sharpener. ， A sharpener can significantly shorten the time of a sharpener. ， Increased efficiency in sharpening knives 。
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