Wafer Dressing Board for Dicing Blades
For blade-stabbing and blade-opening. ， New knives need to be installed and polished. ， Correct the shape of the blade and the blade. 。 In the drawing process. ， Slashes need to be mended regularly ， Make sure the blades are sharp. 。 1. The use of a sharpener. r A razor plate can be replaced. Wafer Fakes are for grinding. Dicing Blade r Compared to traditional use Silicon Wafer The sharpener. ， Significant increase in the efficiency of cutting machines r It'll only take a few minutes. ， I can finish the sharpening blade. ， And saving material costs by increasing cutting efficiency. 2. Why use a sharpener? ？ r The sharpener plate can be new. Wafer Dicing Blade Pre-use to increase the sharpness of blades r Install new blades → A sharpener. → Cut Wafer r- After the new blades were sharpened ， Makes Diamond The surface is flat. ， r And thus prevent Wafer Cutting the edges or cracks. 3. Advantages —— Cost savings Compared to tradition Silicon Wafer The way to cut the sharpener. ， A sharpener can significantly shorten the time of a sharpener. ， Increased efficiency in sharpening knives 。
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