Silicon Aspheric Lens PAsSi-
Silicon aspherical lenses have advantages such as high transmittance, high precision, and high stability, and can be used to manufacture high-precision optical systems and instruments, such as infrared imaging systems, infrared spectrometer systems, etc. Due to its high refractive index and dispersion properties, silicon can also be used to manufacture lenses and lenses with special optical effects. It can be coated with MgF2, UV-AR, UV-VIS, VIS-EXT, VIS-NIR, NIR I, NIR II, Telecom NIR, SWIR, SWIR, YAG-BBAR and other film systems.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Dia | 2-300 mm |
| Focal Length | 15-5000 mm |
| Center Thickness | 0.12-60 mm |
| Edge Thickness | 0.12-60 mm |
| Design Wavelength | Custom |
| Radius of Curvature | Custom |
| Surface Quality | 60-40 |
| Diameter Tolerance | +0.0/-0.1 |
| Thk Tolerance | ±0.1 mm |
| Substrate Material | Silicon（Si） |
| PV [@632.8nm] | λ/4 |
| Centering | <3′ |
| Clear Aperture | >90% |
| Coating | Uncoated |
| REACH | Compliant |
| ROHS | Compliant |
| Transmission Range [Substrate Material：Silicon（Si）] | 1.2-15μm |
| Refractive Index [Substrate Material：Silicon（Si）；@10μm] | 3.41776%@10μm |
| Reflection Loss [Substrate Material：Silicon（Si）；@10μm] | 46.1%@10μm |
| Structure [Substrate Material：Silicon（Si）] | Single crystal,synthetic |
| Cleavage Planes [Substrate Material：Silicon（Si）] | <111> |
| Density [Substrate Material：Silicon（Si）] | 2.33 g/cm³ |
| Melting Point [Substrate Material：Silicon（Si）] | 1414 ℃ |
| Thermal Conductivity [Substrate Material：Silicon（Si）；@313K] | 163 @ 313K |
| Thermal Expansion [Substrate Material：Silicon（Si）；@293K] | 2.6 @ 293K |
| Knoop Hardness [Substrate Material：Silicon（Si）] | 1100 kg/mm² |
| Specific Heat Capacity [Substrate Material：Silicon（Si）] | 712.8 J/(kg×K) |
| Dielectric Constant [Substrate Material：Silicon（Si）；@f= 9.37GHz] | 13 @f= 9.37GHz |
| Young's Modulus (E) [Substrate Material：Silicon（Si）] | 130.91 GPa |
| Shear Modulus(G) [Substrate Material：Silicon（Si）] | 79.92 GPa |
| Bulk Modulus(K) [Substrate Material：Silicon（Si）] | 101.97 GPa |
| Poisson Coefficient [Substrate Material：Silicon（Si）] | 0.266 |
| Solubility [Substrate Material：Silicon（Si）] | None |
| Molecular Weight [Substrate Material：Silicon（Si）] | 28.09 g/mol |
Applications
Datasheet
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