ZSIRM-Z1D37N82
ZSIRM-Z1D37N82 is an infrared receiver for remote control and other applications requiring improved ambient-light rejection. A separate PIN diode and preamplifier IC circuit are assembled on a single lead frame. The epoxy package contains a special infrared filter. The module performs well even under interfering ambient light and provides protection against uncontrolled output pulses. Data formats: NEC & Toshiba Code, RC5/RC6 Code, and Sony 12bit Code are supported; Sony 15bit/20bit Code and XMP/RCMM Code are not supported. The minimum distance for normal operation between the RCM and Transmitter is 30cm. The reflow-soldering table separately lists a maximum T_A to T_P of 480s (the original label contains letters only; no new parameter name is invented).
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Power Supply Voltage Supply voltage Vcc [Absolute Maximum Ratings ;Ta=25℃] | 0–6 V |
| Operating Temperature Operating Temperature Topr [Absolute Maximum Ratings ;Ta=25℃] | -30~+85 ℃ |
| Storage Temperature Tstg [Absolute Maximum Ratings ;Ta=25℃] | -30~+85 ℃ |
| Lead Soldering Temperature Tsol [Absolute maximum ratings; Ta=25℃; <5s; solder at least 2.5mm from the encapsulant, within 5s] | 260 ℃ |
| Operating Voltage working voltage Vcc [Optoelectronic Characteristics ；Ta=25℃] | min ：2.7； max ：6.0 |
| Quiescent Current / Supply Current Icc [Optoelectronic Characteristics ；Ta=25℃；No Input Signal] | typical ：0.2； max ：0.6 |
| Carrier Frequency B.P.F. Center Frequency fo [Optoelectronic Characteristics ；Ta=25℃] | typical ：38 |
| Peak Wavelength λp [Optoelectronic Characteristics ；Ta=25℃] | typical ：940 |
| Low-Level Output / Low-Level Output Voltage [Optoelectronic Characteristics ；Ta=25℃] | max ：0.40 |
| High-Level Output / High-Level Output Voltage Voh [Optoelectronic Characteristics ；Ta=25℃] | min ：VDD-0.3； max ：VDD |
| Pulse Width Tpw [Optoelectronic Characteristics ；Ta=25℃] | min ：480； max ：720 |
| Arrival Distance | min ：20 |
| Half Angle 2θ1/2 [Optoelectronic Characteristics ；Ta=25℃] | typical ：±45 |
| Minimum burst length t_Burst [Data signal limitation] | 300 us |
| Minimum gap time after each burst t_Gap [Data signal limitation] | 350 us |
| Minimum pause time in the data stream t_Pause_min [Data signal limitation] | Min.25 |
| Required data pause time t_Pause [Data signal limitation] | >(Data word length/3)+18.5ms |
| High temperature [Reliability Test; Note 2: Must Meet Optoelectronic Characteristics after 1 Hour at Room Temperature] | Ta=+80℃；t=48H |
| Life Test [Reliability Test; Note 2: Must Meet Optoelectronic Characteristics after 1 Hour at Room Temperature] | VCC=5V；t=500H |
| Low temperature [Reliability Test; Note 2: Must Meet Optoelectronic Characteristics after 1 Hour at Room Temperature] | Ta=-30℃；t=48H |
| Temperature cycle [Reliability Test; Note 2: Must Meet Optoelectronic Characteristics after 1 Hour at Room Temperature] | -35℃(0.5H)~+85℃(0.5H)，20cycle |
| Dropping [Reliability Test; Note 2: Must Meet Optoelectronic Characteristics after 1 Hour at Room Temperature] | Free fall from a height of 75cm onto a hardwood board, 3 times |
| Soldering ability test [Reliability Test; Note 3: Must Meet Optoelectronic Characteristics and Solder Coverage ≥90%] | Ta=260℃；t=5s |
| Room temperature T_A [Pb-free Solder；Reflow Soldering Guidelines] | Recommended: 25 |
| Ramp-up Rate [Pb-free Solder；T_A to 150℃] | max:3 ℃/s |
| Time t_s [Pb-free Solder；Reflow Soldering Guidelines] | min:60; recommended: 100; max:120 s |
| Ramp-up Rate [Pb-free Solder；T_Smax to T_P] | max:3 ℃/s |
| Liquidus temperature T_L [Pb-free Solder; fixed value spanning the original table's three value columns] | 217 ℃ |
| Time above liquidus temperature t_L [Pb-free Solder；Reflow Soldering Guidelines] | max:100 s |
| Peak temperature T_P [Pb-free Solder；Reflow Soldering Guidelines] | max:260 ℃ |
| Time t_P [Pb-free Solder；Reflow Soldering Guidelines] | min:10; recommended: 20; max:30 s |
| Ramp-down Rate [Pb-free Solder；T_P to 100℃] | max:6 ℃/s |
Applications
Key Features
Datasheet
Supplier Information
Related Products
-
1700nm PD
Optical Detectors
Mindsemi
-
4×100G PAM4 PD Array
Optical Detectors
Mindsemi
Product Rate: 100G
-
4×10G PD Array
Optical Detectors
Mindsemi
Product Rate: 10G
-
Silicon photomultiplier
Optical Detectors
Adapsphotonics
Lingming Photonics' latest P5P silicon photomultipliers combine photon trapping, microlenses, and back-side illumination (BSI). At 905nm they offer PDE up to 25%, with recovery time, dark count rate, crosstalk, and other parameters leading competing products. Optimized for lidar, the P5P maintains high PDE at lower bias and operates at temperatures up to 105°C. For automotive reliability, the P5P SiPM was expected to complete AEC-Q102 by the end of 2022. Lingming offers single-line to 16-line SiPMs and customer-specific development.
-
ADS6311 fully solid-state large-array SPAD dToF chip
Optical Detectors
Adapsphotonics
Using advanced 3D-Stacking and loop-based TDC design, Lingming Photonics stacks sensitive SPAD devices above high-speed logic, combining sensing, computation, and storage. Multiple generations have achieved grayscale output up to 768x576 and TOF depth output at 256x192, enabling high-resolution depth-camera chips.
Related Articles
Founded in Beijing in 2011, Beijing FJR Opto-electronic Technology Co., Ltd. specializes in R&D, manufacturing and sales of infrared thermal imaging equipment and complete optoelectronic systems.
On November 28, 2024, the 3rd China Laser Star Enterprise Summit & Advanced Laser Processing Technology Summit, an annual influential event in the laser industry, was grandly held in Wuhan Optics Valley.
As fundamental refractive optical components, plano‑convex spherical lenses consist of one convex spherical surface and one flat surface.
As premium broadband light sources situated between traditional LEDs and laser diodes, MicroLight superluminescent‑diode (SLD) products combine broad spectral bandwidth, sufficient optical output power and low‑coherence performance.
Loading...
Name
Phone
Organization
Use Case
Database Platform