ADS6311 fully solid-state large-array SPAD dToF chip

ADS6311 fully solid-state large-array SPAD dToF chip

Supplier
Adapsphotonics
Category
Optical Detectors
Origin
China

Using advanced 3D-Stacking and loop-based TDC design, Lingming Photonics stacks sensitive SPAD devices above high-speed logic, combining sensing, computation, and storage. Multiple generations have achieved grayscale output up to 768x576 and TOF depth output at 256x192, enabling high-resolution depth-camera chips.

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Overview

Using advanced 3D-Stacking and loop-based TDC design, Lingming Photonics stacks sensitive SPAD devices above high-speed logic, combining sensing, computation, and storage. Multiple generations have achieved grayscale output up to 768x576 and TOF depth output at 256x192, enabling high-resolution depth-camera chips.

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Adaps Photonics was founded in 2018 by a top-tier team of returnee PhDs. The company has offices in Hangzhou, Shenzhen, Deqing, and Shanghai Zhangjiang, with a total of over 100 employees, including more than 10 PhDs from top international universities, and R&D personnel accounting for over 80%. The company's technical strength has been nationally recognized, having been awarded as a national-level specialized and sophisticated "Little Giant" enterprise and a national high-tech enterprise. It leads the construction of the Guangdong Provincial Engineering Technology Research Center for Intelligent Recognition 3D Perception Optoelectronic Chips, and collaborates with universities such as Tsinghua University. With its ultra-high-speed optoelectronic chip technology, it has successfully undertaken the National Key R&D Program's disruptive technology innovation key project, demonstrating outstanding technological frontier and strategic value. The single-photon avalanche diode (SPAD) designed by Adaps Photonics is a core device that helps modern electronic devices achieve 3D perception, widely empowering fields such as automobiles, smartphones, robotics, automatic control, human-computer interaction, and smart homes. The company offers a series of SPAD dToF sensor chip products, including: SiPM, 3D stacked dToF modules, limited-point dToF sensors, etc. Our products have industry-leading accuracy, energy efficiency, and ranging range. In order to bring the most cutting-edge SPAD and 3D sensing research results to technology popularization and commercialization, we focus on using BSI 3D stacking technology to hybrid bond back-illuminated sensor chip wafers and digital logic circuit wafers, thereby achieving excellent performance and system integration. Adaps Photonics also provides dToF system solutions based on SPAD. Leading customers in the automotive and consumer electronics fields have chosen to work closely and long-term with the company due to our pursuit of excellent product performance and mass production delivery capabilities. Through deep cultivation of multiple domestic and international supply chain systems, Adaps Photonics ensures comprehensive stability of production and supply quality. Our product quality meets the requirements of multiple heavyweight system standards such as ISO 9001, IATF16949, AEC-Q100, and AEC-Q102. Adaps Photonics, join hands with you to create insight for the future!

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ADS6311 fully solid-state large-array SPAD dToF chip
Adapsphotonics · Optical Detectors
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