Automatic Silicon Photonics and LiNbO3 Chip Coupling Stage
1. Fully automatic high-precision six-axis (XYZ, θXθYθZ) motorized modules, configurable as dual six-axis or larger combinations. 2. High-precision eddy-current sensors for automatic parallel alignment, with a three-dimensional gantry and long-travel Junhe Jingji stepper motors. 3. Machine-vision positioning supports parallel and vertical coupling. 4. Custom chip/FA/lens fixtures with TEC temperature control. 5. Automatic probe lowering, independent channel power modules, automatic dispensing and UV curing. 6. Spectral scanning and optoelectronic parameter testing.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Repeatability [IL/PDL Variation During Repeated Coupling of the Same Chip] | <0.1 dB |
| Stability [Maximum IL Change Within 5 Minutes After Applying Adhesive or Index-Matching Fluid] | <0.05 dB |
| Coupling Accuracy | <0.1 dB |
| Coupling Efficiency [Light-Finding and Coupling Time] | <25 s |
| Test Throughput [CL Band Scanning Test Time] | <15 s |
Datasheet
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