High power 1064nm 200mW Pump laser module
This 1064nm laser module uses a planar chip-on-submount structure. The high-power chip is hermetically sealed in an epoxy-free, flux-free 14-pin butterfly package with a thermistor, TEC and monitor diode.
Specification Snapshot
Operating Wavelength l_c
min:1059 nm;typical:1064 nm;max:1069 nm
Forward Current I_f
typical:300 mA;max:400 mA
Threshold Current Iₜₕ
typical:50 mA;max:90 mA
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Overview
This 1064nm laser module uses a planar chip-on-submount structure. The high-power chip is hermetically sealed in an epoxy-free, flux-free 14-pin butterfly package with a thermistor, TEC and monitor diode.
Specifications
| Parameter | Value |
|---|---|
| Fiber output power P_f | min:130 mW;typical:150 mW;max:170 mW |
| Operating Wavelength l_c | min:1059 nm;typical:1064 nm;max:1069 nm |
| Wavelength Temperature Tunability | typical:0.01 nm/℃ |
| Spectral width (FWHM) Dl | typical:0.3 nm;max:0.8 nm |
| Forward Current I_f | typical:300 mA;max:400 mA |
| Threshold Current Iₜₕ | typical:50 mA;max:90 mA |
| Rise time in pulse mode tᵣ | max:30 ns |
| TEC Current I_TEC [@70℃] | max:2.0 A |
| TEC Voltage V_TEC [@70℃] | max:3.0 V |
| Thermistor B constant | typical:3900 K |
Applications
Spectroscopy; Telecommunications; Lighting; Sensing
Key Features
FBG wavelength-stabilized single-mode laser; continuous or pulsed operation; operating temperature range of -40℃ to +50℃; wavelength/temperature coefficient of 0.01nm/℃; built-in monitoring photodiode, thermoelectric cooler and thermistor; single-mode fiber pigtail (Corning HI1060, NA=0.14, mfd=6.2um@1060nm); optional FC/APC connector.
Datasheet
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Supplier Information
Shenzhen Bokosi Optoelectronic Technology Co., Ltd. focuses on the R&D, sales, and technical development of optoelectronic products. It also deals in optical transmission products, power batteries, laser equipment and accessories, electronic products and components, and provides import and export services.
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