Nd:YVO₄+KTP
Our Nd:YVO₄+KTP bonded crystal is formed by bonding KTP to one end of Nd:YVO₄, effectively improving the overall performance of Nd:YVO₄ lasers. The thermal conductivity of Nd:YVO₄ is ∥C:5.23W/m/K and ⊥C:5.10W/m/K; that of KTP is 0.13W/m/k (@100℃). Bonding both ends to form Nd:YVO4+KTP improves the thermal behavior of Nd:YVO₄, reduces pump-induced thermal lensing, improves beam quality and laser output efficiency at 457nm and 671nm, increases output stability, and extends laser service life. Crylink uses surface-activated bonding, a low- or room-temperature bonding technology characterized by surface cleaning and surface activation. Before bonding, bombardment of the bonding surfaces by fast atoms or ion beams can effectively increase bond strength and enable high-quality bonding among inorganic materials, metals, and semiconductors. Compared with high-temperature thermal bonding, surface-activated bonding provides higher interfacial bond strength and better control of optical absorption loss and surface-figure changes. In thermal diffusion bonding, impurities on the surfaces cannot be removed and become trapped at the bonding interface. Surface-activated bonding can remove polishing residues, organic contamination, and surface oxide layers, break chemical bonds in the material, and increase activation energy. The Nd:YVO₄+KTP bonded crystals have high bond strength, low absorption loss at the interface (generally less than 20ppm), and little surface-figure change at the interface (surface figure after bonding <lamda/8). Available shapes include rods, slabs, waveguides, and sandwich structures. Various coatings can be provided on both ends, including AR@1064nm&532nm on both end faces. Nd:YVO₄+KTP bonded crystals are widely used in machinery, materials processing, spectroscopy, wafer inspection, displays, medical testing, laser printing, and data storage.
Overview
Specifications
| Parameter | Value |
|---|---|
| concentrations [Materials:Nd:YVO₄] | 0.5%,1%, 2%,2,5%, 3% |
| Structure [Materials:Nd:YVO₄ / Structure;KTP:Rods/Slabs/Sandwich/Waveguide/] | Rods/Slabs/Sandwich/Waveguide/ |
| Structure [Materials:KTP / Structure;Nd:YVO₄:Rods/Slabs/Sandwich/Waveguide/] | Rods/Slabs/Sandwich/Waveguide/ |
| End-face Configuration [Materials:Nd:YVO₄ / End-face Configuration;KTP:Flat/Convex/Wedge] | Flat/Convex/Wedge |
| End-face Configuration [Materials:KTP / End-face Configuration;Nd:YVO₄:Flat/Convex/Wedge] | Flat/Convex/Wedge |
| Side Configuration [Materials:Nd:YVO₄ / Side Configuration;KTP:Polish/Fine Ground] | Polish/Fine Ground |
| Side Configuration [Materials:KTP / Side Configuration;Nd:YVO₄:Polish/Fine Ground] | Polish/Fine Ground |
| Coating available [Materials:Nd:YVO₄ / Coating available;KTP:AR@1064nm&532nm / @1064nm&532nm] | AR@1064nm&532nm |
| Coating available [Materials:KTP / Coating available;Nd:YVO₄:AR@1064nm&532nm / @1064nm&532nm] | AR@1064nm&532nm |
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