Fully Automatic Semiconductor Laser COS Test Machine (TC-1000)
The fully automatic COS tester is an integrated system for comprehensive semiconductor laser chip characterization. It automatically measures optical power, voltage, current, wavelength, far-field divergence and polarization of packaged COS laser chips on a temperature-controlled stage. It displays results, determines pass/fail status, and automatically sorts test data and physical COS devices according to standards.
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Overview
The fully automatic COS tester is an integrated system for comprehensive semiconductor laser chip characterization. It automatically measures optical power, voltage, current, wavelength, far-field divergence and polarization of packaged COS laser chips on a temperature-controlled stage. It displays results, determines pass/fail status, and automatically sorts test data and physical COS devices according to standards.
Specifications
| Parameter | Value |
|---|---|
| Drive Current - Current Mode | CW/QCW |
| Drive Current - Current Range | 0~25A |
| Drive Current-Pulse Width Range | 100μs-1000μs |
| Drive Current-Setting Resolution | 0.1mA |
| Drive Current-Setting Accuracy | ≤0.1% + 15mA |
| Drive Voltage-Voltage Range | 0~10V |
| Drive Voltage-Voltage Reading Resolution | 1mV |
| Drive Voltage-Voltage Reading Accuracy | ≤0.03%+5mV |
| Temperature Control-Control Method | TEC+ Water cooling |
| Temperature Control - Temperature Control Range | 15°C~75°C |
| Temperature Control - Temperature Control Accuracy | ±0.5 |
| Power Measurement - Measurement Range | 0~50W |
| Power Measurement-Measurement Resolution | ±0.1W |
| Spectrum Measurement - Wavelength Range [Other Wavelengths Can Be Customized] | 300~1050nm(Other Wavelengths Can Be Customized) |
| Spectrum Measurement - Accuracy | ±1nm |
| Divergence Measurement-Far-Field Vertical Divergence θ⊥ | -45°~45° |
| Divergence Measurement-Far-Field Horizontal Divergence θ∥ | -30°~30° |
| Divergence angle Measurement - Mechanical Rotation Resolution | 0.1° |
| Machine Exterior-Dimensions (L*W*H) | 1500mm*1340mm*1750mm |
| Machine Exterior-Weight | 500KG |
| Control System-Computer | Windows 64bit |
| Facility Requirements-Electrical Power | 210-230V AC 50Hz 3.2KW |
| Facility Requirements-Air Pressure | 0.6±0.1Mpa |
| Facility Requirements-Chilled-Water Pressure | 0.2~0.3Mpa |
| Facility Requirements-Chilled-Water Flow | ≥10L/min |
| Facility Requirements-Cooling Capacity | ≥100W |
Key Features
Standardized trays allow up to 10 boxes per loading, totaling1000~1500PCS. Linear modules with machine vision automate loading/unloading, switching between boxes and lid opening/closing. Fully automatic testing and sorting replace manual or semiautomatic testing and reduce labor. OCR automatically recognizes COS serial numbers, and all results are stored in the database against each serial number for 100% traceability. Pulsed-current or CW-current testing measures LIV curves (5S/10 current points), spectral characteristics, far-field characteristics and polarization, generating plots and reports. The wide standard test-current range is0-25A. Users can configure temperature, current, voltage and energization rate, define acceptance criteria and classify devices to customer requirements. Results are judged automatically; OK and NG devices are sorted into separate boxes. Cycle time reaches17S/PCS. Versatile characterization supports mounted COS, C-mount and TO packages. Repeated machine-vision checks during handling, overvoltage protection and overcurrent protection prevent chip damage in handling and testing. Main measured parameters: operating current, operating voltage, output power, threshold current, turn-on voltage, power efficiency, slope efficiency, series resistance, far-field horizontal divergence, far-field vertical divergence, peak wavelength, center wavelength, spectral width and degree of polarization.
Datasheet
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Supplier Information
Wuxi Gedad Optoelectronic Technology Co., Ltd. is a high-tech enterprise focusing on the R&D, production and sales of strategic emerging industries such as compound semiconductor packaging, precision packaging equipment, and packaging materials. Through continuous R&D investment, the company has fully mastered core technologies in the packaging of GaN lasers, GaAs lasers, and InP lasers. With self-developed equipment and materials, it can provide various packaging forms and devices including single-tube COS, TO, Mount packaging, single Bar packaging, and fiber-coupled modules, as well as customized products. Products are widely used in information technology, display and lighting, life and health, lidar, material processing, optical communication, scientific research and other fields.
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